Tribology in chemical-mechanical planarization /
The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed...
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| Format: | eBook |
| Language: | English |
| Language Notes: | English. |
| Published: |
Boca Raton, Fla. :
Taylor & Francis,
2005.
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| Online Access: | Connect to the full text of this electronic book |
| Summary: | The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other f. |
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| Item Description: | Description based upon print version of record. |
| Physical Description: | 1 online resource (198 p.) |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 0429120087 9780429120084 9786610516780 6610516782 1420028391 9781420028393 |