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Semiconductor packaging : materials interaction and reliability /

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Bibliographic Details
Main Author: Chen, Andrea
Corporate Author: Taylor & Francis
Other Authors: Lo, Randy
Format: eBook
Language:English
Language Notes:English.
Published: Boca Raton : CRC Press, 2011.
Edition:1st edition.
Subjects:
Semiconductors > Reliability.
Electronic packaging > Reliability.
Materials science.
Electrical engineering.
Semi-conducteurs > Fiabilité.
Mise sous boîtier (Électronique) > Fiabilité.
Science des matériaux.
Génie électrique.
electrical engineering.
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Front Cover; Contents; Preface; Authors; Partial list of abbreviations, acronyms, and symbols; Chapter 1: History and background; Chapter 2: Package form factors and families; Chapter 3: Surface-mount technology; Chapter 4: Other packaging needs; Chapter 5: Reliability testing; Chapter 6: Polymers; Chapter 7: Metals; Chapter 8: Ceramics and glasses; Chapter 9: Trends and challenges; Chapter 10: Light-emitting diodes; Glossary; Appendix A: Analytical tools; Appendix B: Destructive tools and tests; Back Cover