Semiconductor packaging : materials interaction and reliability /

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Bibliographic Details

Main Author:	Chen, Andrea
Corporate Author:	Taylor & Francis
Other Authors:	Lo, Randy
Format:	eBook
Language:	English
Language Notes:	English.
Published:	Boca Raton : CRC Press, 2011.
Edition:	1st edition.
Subjects:	Semiconductors > Reliability. Electronic packaging > Reliability. Materials science. Electrical engineering. Semi-conducteurs > Fiabilité. Mise sous boîtier (Électronique) > Fiabilité. Science des matériaux. Génie électrique. electrical engineering. Electronic books.
Online Access:	Connect to the full text of this electronic book