http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
materials, models, design, and performance
1 online resource (232 pages) : illustrations (some color), portraits
1. Three-dimensional technology and packaging techniques -- 2. Through silicon vias : materials, properties, and fabrication -- 3. Copper-based through silicon vias -- 4. Modeling and performance analysis of CNT-based through silicon vias -- 5. Mixed CNT bundled through silicon vias -- 6. Graphene nanoribbon-based through silicon vias -- 7. Liners in through silicon vias -- 8. Modeling of through silicon vias using finite-difference time-domain technique.
Brajesh Kumar Kaushik [and three others].
Includes bibliographical references and index.
Interconnects (Integrated circuit technology)
Interconnexions (Technologie des circuits intégrés)