rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Through silicon vias
    sub title: materials, models, design, and performance
  name:
    name part: Kaushik, Brajesh Kumar
    role:
      role term: creator
    role:
      role term: author.
  name:
    name part: Taylor & Francis
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  origin info:
    place:
      place term: flu
    date issued: 2017
    copyright date: 2017
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (232 pages) : illustrations (some color), portraits
  table of contents: 1. Three-dimensional technology and packaging techniques -- 2. Through silicon vias : materials, properties, and fabrication -- 3. Copper-based through silicon vias -- 4. Modeling and performance analysis of CNT-based through silicon vias -- 5. Mixed CNT bundled through silicon vias -- 6. Graphene nanoribbon-based through silicon vias -- 7. Liners in through silicon vias -- 8. Modeling of through silicon vias using finite-difference time-domain technique.
  note: Brajesh Kumar Kaushik [and three others].
  note: Includes bibliographical references and index.
  subject:
    topic: Interconnects (Integrated circuit technology)
  subject:
    topic: Three-dimensional integrated circuits
  subject:
    topic: Interconnexions (Technologie des circuits intégrés)
  subject:
    topic: Circuits intégrés tridimensionnels
  subject:
    topic: Interconnects (Integrated circuit technology)
  subject:
    topic: Three-dimensional integrated circuits
  classification: TK7874.53 .K38 2017
  classification: 621.39/5
  identifier: 131536882X
  identifier: 9781315368825
  identifier: 1498745539
  identifier: 9781498745536
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: AU@
    record creation date: 160526
    record change date: 20260205202954.1
    record identifier: in00005680192
    language of cataloging:
      language term: eng