SiC power module design : performance, robustness and reliability.

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carb...

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Bibliographic Details
Main Author: Castellazzi, Alberto
Corporate Author: Knovel (Firm)
Other Authors: Irace, Andrea
Format: eBook
Language:English
Published: Stevenage : Institution of Engineering and Technology, 2022.
Series:Energy Engineering Ser.
Subjects:
Online Access:Connect to the full text of this electronic book
Description
Summary:Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.
Physical Description:1 online resource (425 pages).
ISBN:1523142553
9781523142552