http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Thermomechanical simulation methodologies for advanced semiconductor packaging
Institution of Engineering and Technology
1 online resource (xii, 181 pages) : illustrations.
Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges. It's important to be able understand and predict the thermomechanical reliability of advanced electronic packaging. Traditional trial-and-error approaches are time-consuming, expensive, and often unable to capture the intricacies of real-world operating conditions. Numerical simulation technology, particularly finite element analysis (FEA), can enable precise simulation and analysis of the multi-physics issues in electronic packaging, thereby assisting researchers in electronic packaging product design and reliability assessment. There is a growing demand for more accurate and efficient simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering researchers and engineers with the knowledge and tools necessary to optimize electronic package designs, predict reliability, and accelerate the development process. This book showcases various failure types and modes for advanced electronic packaging, in assembly, manufacturing and testing. Each chapter incorporates practical case studies, highlighting real-world applications of simulation methodologies to address complex challenges in electronic packaging. Topics covered include numerical simulation methods for warpage evolution, solder joint fatigue, vibration, and drop impact. This concise reference on recent developments in the field offer useful insights for researchers and engineers working on electronic packaging and its reliability.
Intro -- Contents -- Preface -- Acknowledgments -- About the authors -- 1. Advanced semiconductor electronic packaging -- 2. Warpage evolution of TSV wafer based on a hierarchy multiscale analysis method -- 3. Investigation on fatigue life of solder joints for 2.5D packaging structures -- 4. Molding process simulation of substrates -- 5. Structural integration simulation under vibration for PBGA packaging -- 6. Electromigration simulation study of copper interconnects in 3D packaging -- 7. Study on the influence of mechanical properties of TSV-Cu on cracking in TSV/RDL interconnect structures -- 8. Mechanical response of solder joints under drop impact loads -- Index
Includes bibliographical references and index (pages [177]-181).
London, United Kingdom : Institution of Engineering & Technology, 2025
Materials, circuits and devices series ; 85