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Biscuit baking technology processing and engineering manual /

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Bibliographic Details
Main Author: Davidson, Iain (Author)
Corporate Author: Knovel (Firm)
Format: eBook
Language:English
Published: Amsterdam : Academic Press, 2023.
Edition:Third edition.
Subjects:
Biscuits.
Baking.
Cuisson au four.
Baking
Biscuits
Electronic books.
handbooks.
Handbooks and manuals.
Guides et manuels.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Front Cover
  • Biscuit Baking Technology
  • Copyright Page
  • Contents
  • About the author
  • Iain Davidson, Director, Baker Pacific Ltd.
  • Baker Pacific Ltd.
  • Experience in the biscuit industry
  • Acknowledgements
  • Introduction
  • 1 The biscuits, cookies and crackers
  • 1.1 The biscuits, cookies and crackers
  • 1.2 Crackers
  • 1.3 Soda crackers: process for sponge and dough
  • 1.3.1 Description
  • 1.3.2 Product specification
  • 1.3.3 Formulation
  • 1.3.4 Critical ingredients
  • 1.3.5 Mixing and fermentation
  • 1.3.6 Dough forming
  • 1.3.7 Baking
  • 1.3.8 Oil spray
  • 1.3.9 Cracker breaking
  • 1.4 Cream crackers: process for laminated crackers
  • 1.4.1 Description
  • 1.4.2 Product specification
  • 1.4.3 Recipe
  • 1.4.4 Dough mixing on a horizontal high-speed mixer
  • 1.4.5 Preparation of the fat/flour for dusting
  • 1.4.6 Lamination
  • 1.4.7 Baking
  • 1.5 Snack crackers
  • 1.5.1 Process for snack crackers
  • 1.5.2 Description
  • 1.5.3 Product specification
  • 1.5.4 Formulation
  • 1.5.5 Critical ingredients
  • 1.5.6 Mixing
  • 1.5.7 Standing time
  • 1.5.8 Forming
  • 1.5.9 Baking
  • 1.5.10 Baking band
  • 1.6 Semi-sweet biscuits
  • 1.6.1 Process for semi-sweet biscuits
  • 1.6.2 Description
  • 1.6.3 Product specification
  • 1.6.4 Formulation
  • 1.6.5 Critical ingredients
  • 1.6.6 Mixing
  • 1.6.7 Forming
  • 1.6.8 Baking
  • 1.6.9 Cooling
  • 1.7 Process for Golden Maria or Dorada
  • 1.7.1 Description
  • 1.7.2 Product specification
  • 1.7.3 Formulation
  • 1.7.4 Mixing
  • 1.7.5 Dough forming
  • 1.7.6 Baking
  • 1.8 Short doughs: rotary moulded biscuits
  • 1.8.1 Process for moulded short dough biscuits
  • 1.8.2 Description
  • 1.8.3 Product specification
  • 1.8.4 Formulation
  • 1.8.5 Critical ingredients
  • 1.8.6 Mixing
  • 1.8.7 Standing time
  • 1.8.8 Rotary moulding
  • 1.8.9 Baking
  • 1.8.10 Cooling
  • 1.8.11 Process for ginger biscuits.
  • 1.8.12 Description
  • 1.8.13 Product specification
  • 1.8.14 Formulation
  • 1.8.15 Process for ginger crunch biscuits
  • 1.9 Cookies
  • 1.10 Process for a chocolate chip cookie
  • 1.10.1 Description
  • 1.10.2 Product specification
  • 1.10.3 Formulation
  • 1.10.4 Mixing
  • 1.10.5 Forming
  • 1.10.6 Baking
  • 1.10.7 Cooling
  • 1.11 Sandwich biscuits
  • 1.11.1 Description
  • 1.11.2 Recipes for creams
  • 1.11.3 Process for sandwich production
  • 1.12 Long shelf life cakes, snack cakes
  • 1.12.1 Process for Jaffa cakes
  • 1.12.2 Product specification
  • 1.12.3 Mixing
  • 1.12.4 Baking
  • 1.12.5 Cooling and jam depositing
  • 1.12.6 Recipes
  • 1.13 Summary
  • References
  • 2 Baking process
  • 2.1 From the dough piece to the biscuit
  • 2.1.1 Biscuit structure
  • 2.1.2 Moisture content
  • 2.1.3 Colour
  • 2.2 Ingredients
  • 2.2.1 Wheat flour
  • 2.2.2 Wheat flours: typical specifications
  • 2.2.2.1 Wheat gluten
  • 2.2.2.2 Starch
  • 2.2.3 Sugar
  • 2.2.4 Leavening agents
  • 2.2.4.1 Yeast
  • 2.2.4.2 Sodium bicarbonate ("soda")
  • 2.2.4.3 Ammonium bicarbonate ("vol")
  • 2.2.5 Fats
  • 2.3 Baking process
  • 2.3.1 Development of the biscuit structure and texture
  • 2.3.2 Moisture removal
  • 2.3.3 Colour
  • 2.3.4 Summary
  • References
  • 3 Baking profiles
  • 3.1 Crackers
  • 3.1.1 Structure
  • 3.1.2 Moisture content
  • 3.1.2.1 Latent heat of evaporation: 539kcal/kg
  • 3.1.3 Colour
  • 3.1.4 Oven specification
  • 3.1.5 Baking profile
  • 3.2 Snack crackers
  • 3.2.1 Structure
  • 3.2.2 Baking process
  • 3.2.3 Moisture content
  • 3.2.4 Colour
  • 3.2.5 Baking times and temperatures
  • 3.2.6 Baking profile
  • 3.3 Semi-sweet biscuits
  • 3.3.1 Structure
  • 3.3.2 Moisture content
  • 3.3.3 Colour
  • 3.3.4 Oven specification
  • 3.3.5 Baking profile
  • 3.4 Short dough biscuits
  • 3.4.1 Structure
  • 3.4.2 Moisture content
  • 3.4.3 Colour
  • 3.4.4 Oven specification.
  • 3.4.5 Baking profile
  • 3.5 Cookies
  • 3.5.1 Structure
  • 3.5.2 Moisture content
  • 3.5.3 Colour
  • 3.5.4 Oven specification
  • 3.5.5 Baking profile
  • References
  • 4 Biscuit design and output
  • 4.1 Cutter and moulding roll layouts
  • 4.2 Scrap and scrapless designs
  • 4.3 Semi-sweet biscuits
  • 4.4 Short dough biscuits and cookies
  • 4.5 Docker pins
  • 4.6 Oven band loadings
  • 4.7 Oven size and output
  • 4.7.1 Output calculation
  • 4.8 Summary
  • Further reading
  • 5 Heat transfer
  • 5.1 Radiation
  • 5.1.1 Wavelength
  • 5.1.2 Radiant heat transfer
  • 5.1.3 Distance
  • 5.1.4 Effect of radiation on the dough pieces
  • 5.1.5 Radio-frequency baking
  • 5.1.6 Near-infrared baking
  • 5.1.7 Microwave
  • 5.2 Conduction
  • 5.2.1 Baking with conduction
  • 5.2.2 Oven insulation
  • 5.3 Convection
  • 5.3.1 Convection baking
  • 5.4 Summary
  • 5.4.1 Radiation
  • 5.4.2 Conduction
  • 5.4.3 Convection
  • Further reading
  • 6 Oven designs
  • 6.1 Heat transfer methods
  • 6.1.1 Radiant heating
  • 6.1.2 Conduction heat transfer
  • 6.1.3 Convection baking
  • 6.2 Radiant heating
  • 6.2.1 Direct gas-fired ovens
  • 6.2.2 Conversion to electrical heating
  • 6.2.3 Summary
  • 6.2.4 Electric ovens
  • 6.2.5 Summary
  • 6.2.6 Indirect radiant ovens
  • 6.2.7 Summary
  • 6.3 Turbulence systems
  • 6.4 Conduction heat transfer
  • 6.5 Convection baking
  • 6.5.1 Direct convection ovens
  • 6.5.2 Indirect convection ovens
  • 6.5.3 Summary
  • 6.5.4 'Re-circ' ovens
  • 6.5.5 Summary
  • 6.6 Hybrid ovens
  • 6.6.1 Direct gas-fired/indirect radiant ovens
  • 6.6.2 Direct gas-fired/convection ovens
  • Further reading
  • 7 Oven specifications
  • 7.1 Specifications for ovens: crackers
  • 7.1.1 Development of structure and texture
  • 7.1.2 Reducing moisture content
  • 7.1.3 Colour
  • 7.1.4 Final moisture content
  • 7.1.5 Recommended specification for a cracker oven.
  • 7.2 Recommended oven specification for light carrier products, for example crispbreads, rusks
  • 7.3 Recommended oven specification for semi-sweet biscuits, for example Marie
  • 7.4 Recommended oven specification for short dough biscuits
  • 7.5 Specifications for ovens: soft dough cookies
  • 7.6 Danish butter cookies
  • 7.7 Modular oven design
  • 7.8 Calculation of oven zone lengths
  • 7.8.1 Example 1: Direct gas-fired oven for baking crackers (1.5×100m long)
  • 7.8.1.1 Heat input
  • 7.8.2 Example 2: Indirect radiant oven for baking a short dough biscuit, glucose type (1.25m×100m long)
  • 7.8.2.1 Heat input
  • 7.8.3 Example 3: Multipurpose oven 1.25m×91.0m
  • Additional information on sources
  • Biscuit oven manufacturers
  • Oven band manufacturers
  • Oven burner manufacturers
  • Heat flux technology
  • 8 Oven construction: direct gas-fired ovens
  • 8.1 Direct gas-fired baking chamber
  • 8.1.1 Baking chamber construction
  • 8.1.2 Conversion of gas-fired oven to electric
  • 8.1.3 Materials
  • 8.1.4 Dimensions
  • 8.1.5 Expansion joints
  • 8.1.6 Insulation
  • 8.1.7 Oven return band covers
  • 8.1.8 Explosion relief
  • 8.1.9 Inspection doors
  • 8.1.10 Cleanout doors
  • 8.2 Extraction system
  • 8.2.1 Fan specification
  • 8.2.2 Extraction: oven end hood
  • 8.3 Direct gas-fired oven: gas burner system
  • 8.3.1 Gas train
  • 8.3.2 Combustion air
  • 8.3.3 Temperature control system
  • 8.3.4 Flynn burners for direct gas-fired oven
  • 8.3.5 Infrared metal fibre burners
  • 8.3.6 Flynn infrared profile 7 distributor burner
  • 8.4 Control panels
  • 8.4.1 Main control panels
  • 8.4.2 Control panel construction
  • Further reading
  • 9 Oven construction: indirect radiant ovens
  • 9.1 Indirect radiant baking chamber
  • 9.1.1 Baking chamber construction and dimensions
  • 9.1.2 Expansion joints
  • 9.1.3 Heater module
  • 9.1.4 Radiant tubes
  • 9.1.5 Return ducts.
  • 9.1.6 Circulation fan
  • 9.1.7 Extraction and turbulence
  • 9.1.8 Heat exchanger flue (chimney)
  • 9.1.9 Explosion relief
  • 9.1.10 Insulation
  • 9.1.11 Inspection doors
  • 9.1.12 Cleanout doors
  • 9.2 Indirect fired ovens: burners
  • 9.2.1 Weishaupt burners
  • 9.2.1.1 Technical description
  • 9.2.1.2 Specification: Weishaupt burner WG30N/1-C ZM LN (for 1.25m wide indirect radiant oven)
  • 9.2.2 Maxon burners
  • 9.2.2.1 Specification for 1.2m wide indirect radiant oven
  • 9.2.2.1.1 Maxon OVENPAK 515 gas/oil burner
  • 9.2.2.1.2 Maxon gas pipe trains
  • 9.2.2.1.3 Pilot gas train
  • 9.2.2.1.4 Oil pipe train
  • 9.2.2.1.5 Compressed air train
  • Further reading
  • 10 Heat recovery system
  • 10.1 Heat recovery system
  • 10.1.1 Calculations of hot air flow to the HRS zone
  • Further reading
  • 11 Oven construction: convection ovens
  • 11.1 Direct and indirect convection systems
  • 11.2 Baking chamber
  • 11.2.1 Baking chamber construction
  • 11.2.2 Convection plenums
  • 11.2.3 Return air
  • 11.2.4 Circulation fan
  • 11.2.5 Heater module
  • Further reading
  • 12 Oven construction: electric ovens
  • 12.1 Electric oven construction
  • 12.2 Electrical elements
  • 12.3 Conversion of direct gas-fired oven to electrically heated oven
  • 12.4 Oven efficiency
  • 12.5 Ovens with hot air circulation
  • 12.5.1 Indirect radiant oven
  • 12.5.2 Convection ovens
  • 12.6 Control systems
  • Further reading
  • 13 Oven conveyor bands (belts)
  • 13.1 Rolled wire-mesh bands (belts)
  • 13.1.1 Z-type bands
  • 13.1.2 Wire-mesh bands: skid bar supports
  • 13.1.3 Wire-mesh bands: support rollers
  • 13.1.4 Return band supports
  • 13.1.5 Wire-mesh oven band cleaning
  • 13.1.6 Wire-mesh oven band tracking
  • 13.1.7 Joining wire-mesh bands
  • 13.1.8 Dimensions of rolled wire-mesh belts
  • 13.2 Compound balanced weave bands
  • 13.2.1 Compound balanced weave band supports.