Proceedings /

Proceedings of the 1978 International Microelectronics Symposium, September 25-27, 1978, Radisson Hotel Downtown, Minneapolis, MN /
Published: (1978)

Modern microelectronic : circuit design, IC applications, fabrication technology /
Published: (1981)

Proceedings /

Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005 : presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA /
Published: (2005)

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana /
Published: (2002)

Electronic and photonics packaging : Multi-Scale Electrical and Mechanical Systems--2006 presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois, USA /
Published: (2007)

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology--2003 : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C. /
Published: (2003)

Electronic and photonics packaging, electrical systems design and photonics, and nanotechnology--[2004] : presented at 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California, USA /
Published: (2004)

Proceedings of the 1984 Custom Integrated Circuits Conference : Genesee Plaza/Holiday Inn, Rochester NY, May 21-23, 1984.
Published: (1984)

Thermal stress and strain in microelectronics packaging /
Published: (1993)

Semi-custom IC design and VLSI /
Published: (1983)

Multichip module technologies and alternatives : the basics /
Published: (1993)

IEEE ... International New Circuits and Systems Conference.

Fundamentals of microsystems packaging /
Published: (2001)

Proceedings.
Published: (1994)

Proceedings of the 1990 International Symposium on Microelectronics, October 15-17, 1990, McCormick Place North, Chicago, Illinois /
Published: (1990)

Advances in electronic circuit packaging.
Published: (1962)

Microelectronics interconnection and packaging /
Published: (1980)

Proceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits.

Dealing with electronics /
by: Drosg, Manfred, et al.
Published: (2014)

Integrated circuit design /
by: Murray, Alan F.
Published: (1987)

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability /
Published: (1994)

Foldable flex and thinned silicon multichip packaging technology /
Published: (2003)

Introduction to system design using integrated circuits /
by: Sonde, B. S.
Published: (1980)

Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California /
Published: (2001)

Proceedings : 1998 IEEE Symposium on IC/Package Design Integration, February 2-3, 1998, Santa Cruz, California /
Published: (1998)

Directions for the next generation of MMIC devices and systems /
Published: (1997)

... IEEE Dallas Circuits and Systems Conference.
Published: (2009)

Proceedings of ESSCIRC /

High-frequency characterization of electronic packaging /
by: Martens, Luc, 1963-
Published: (1998)

Electronic equipment packaging technology /
by: Ginsberg, Gerald L.
Published: (1992)

Proceedings of the EMIT '98 : Second International Conference on Emerging Microelectronics & Interconnection Technologies, February 16 - 20, 1998, Bangalore, India / [edited and assembled by the Technical Program Committee of EMIT '98].
Published: (1998)

2000 HD International Conference on High-Density Interconnect and Systems Packaging : 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA /
Published: (2000)

Computers /
Published: (2004)

Audio IC circuits manual /
by: Marston, R. M.
Published: (1989)

Chip scale package (CSP) : design, materials, processes, reliability, and applications /
by: Lau, John H.
Published: (1999)