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Proceedings /

Bibliographic Details
Corporate Authors: Electronics Systemintegration Technology Conference, Components, Packaging & Manufacturing Technology Society
Format: Conference Proceeding
Language:English
Published: [Los Alamitos, Calif.] : IEEE, ©2006-
Subjects:
Electronic packaging > Congresses.
Microelectronics > Congresses.
Integrated circuits > Congresses.
Systems integration > Congresses.
Microelectronics.
Integrated circuits.
Electronic packaging.
Systems integration.
Electronic journals.
Conference papers and proceedings.
Online Availability: Check for online availability
Description
Published:Began with 1st (Sept. 5-7, 2006).
Publication Frequency:Biennial
ISSN:2687-9727
2687-9700