Cover Image

IEEE International 3D Systems Integration Conference.

Bibliographic Details
Corporate Author: IEEE International 3D Systems Integration Conference
Format: Conference Proceeding
Language:English
Published: [Piscataway, NJ] : IEEE, 2009-
Subjects:
Three-dimensional integrated circuits > Congresses.
Integrated circuits > Design and construction > Congresses.
Three-dimensional imaging > Congresses.
Integrated circuits > Design and construction.
Three-dimensional imaging.
Three-dimensional integrated circuits.
Electronic journals.
Conference papers and proceedings.
Online Availability: Check for online availability
Description
Published:Began in 2009.
Item Description:None published 2012, 2017-2018.
Physical Description:1 online resource
Publication Frequency:Annual
ISSN:2836-4902
2164-0157