Proceedings of technical papers.

Bibliographic Details
Corporate Authors:	International Microsystems, Packaging, Assembly, and Circuits Technology Conference, Institute of Electrical and Electronics Engineers
Format:	Conference Proceeding
Language:	English
Published:	Piscataway, NJ : Institute of Electrical and Electronics Engineers
Subjects:	Microelectronic packaging > Congresses. Electronic packaging > Congresses. Microelectronics > Congresses. Electronic packaging. Microelectronic packaging. Microelectronics. Electronic journals. Conference papers and proceedings.
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Description
Published:	Began with 2007.
Item Description:	Published by Institute of Electrical and Electronics Engineers in association with individual conference organizations.
Publication Frequency:	Annual
ISSN:	2150-5942 2150-5934