Table of Contents:
  • 1. Introduction
  • 3. Diffusion and Barrier Layers
  • 4. Pattern Generation
  • 5. Deposition Technologies of Materials for Cu-Interconnects
  • 6. Copper Damascene Process and Chemical Mechanical Polishing
  • 7. Conduction and Electromigration
  • 8. Routing and Reliability
  • Glossary (Copper Interconnects).