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Self-Organized 3D Integrated Optical Interconnects : With All-Photolithographic Heterogeneous Integration /

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete...

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Bibliographic Details
Main Author: Yoshimura, Tetsuzo
Corporate Author: Taylor & Francis
Format: eBook
Language:English
Published: Singapore : Jenny Stanford Publishing, [2021]
Subjects:
Optical interconnects.
Interconnexions optiques.
SCIENCE > Magnetism.
SCIENCE > Life Sciences > General.
TECHNOLOGY > Electronics > General.
Optical interconnects
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Cover
  • Half Title
  • Title Page
  • Copyright Page
  • Dedication
  • Table of Contents
  • Preface
  • Chapter 1: Introduction
  • Chapter 2: Guidelines toward Self-Organized 3D Integrated Optical Interconnects
  • 2.1: Advantages of Lightwave Implementation into Boxes of Computers
  • 2.2: Integrated Optical Interconnects
  • 2.3: Self-Organization of 3D Integrated Optical Interconnects
  • 2.4: E-O and O-E Signal Conversion in Integrated Optical Interconnects
  • 2.5: Core Technologies for Self-Organized 3D Integrated Optical Interconnects
  • Chapter 3: Scalable Film Optical Link Modules
  • 3.1: Concept of S-FOLM
  • 3.2: 3D Integrated Optical Interconnects Built by S-FOLMs
  • 3.2.1: 3D OE Platforms
  • 3.2.2: Structures within Boxes of Computers
  • 3.3: Various OE Structures Built by S-FOLMs
  • 3.3.1: OE-Film/Electrical Substrate Stack
  • 3.3.2: OE-Film/OE-Film Stack and Backside Connection
  • 3.3.3: Both-Side Mounting
  • 3.3.4: Micro Optical Link Module
  • 3.3.5: OE Tap Guide
  • 3.3.6: WDM Transceiver and WDM Inter-PCB Connect
  • 3.3.7: 3D Optical Circuits for WDM
  • 3.4: Optoelectronic Amplifier/Driver-Less Substrate
  • 3.4.1: Concept of OE-ADLES
  • 3.4.2: Power Dissipation and RC Delay in OE-ADLES
  • Chapter 4: Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits
  • 4.1: Built-In Mask Method
  • 4.2: Fabrication of Optical Waveguides and Vertical Mirrors
  • 4.2.1: Waveguide Cores
  • 4.2.2: Vertical Mirrors
  • 4.3: Vertical Mirrors with Multi-Core-Layer Skirt-Type Structures
  • 4.3.1: Observation of Beam Leakage and Scattering at Vertical Mirrors
  • 4.3.2: Three-Core-Layer Skirt-Type Vertical Mirrors
  • 4.3.3: Simulations of Beam Leakage/Scattering at Vertical Mirrors
  • 4.3.4: Fabrication of Multi-Core-Layer Skirt-Type Vertical Mirrors
  • 4.4: 3D Optical Circuits
  • 4.4.1: Structures
  • 4.4.2: Type I: Stacked Waveguide Films with Vertical Mirrors
  • 4.4.2.1: Demonstration of 3D optical wiring
  • 4.4.2.2: Loss measurements
  • 4.4.2.3: Loss at Optical Z-Connection
  • 4.4.3: Type II: Waveguide Films with Vertical Waveguides
  • 4.5: Optical Waveguide Films Stacked on Electrical Boards
  • 4.5.1: Process Flow
  • 4.5.2: Waveguide-Film Stacking on PCBs
  • 4.6: Nanoscale Waveguides Made of PRI Sol-Gel Thin Films
  • 4.6.1: Linear, Bending, and Branching Waveguides
  • 4.6.1.1: Fabrication processes
  • 4.6.1.2: Linear waveguides
  • 4.6.1.3: Bending and branching waveguides
  • 4.6.2: Vertical Mirrors and All-Air-Cladding Waveguides
  • Chapter 5: Resource-Saving All-Photolithographic Heterogeneous Integration: PL-Pack with SORT
  • 5.1: Advantages of PL-Pack with SORT over Conventional Packaging
  • 5.2: PL-Pack with SORT
  • 5.2.1: Whole Process Flow of PL-Pack with SORT
  • 5.2.2: Process Flow of SORT
  • 5.3: Impacts of PL-Pack with SORT
  • 5.3.1: Material Consumption and Costs
  • 5.3.2: Mechanical Properties
  • 5.3.3: Transfer Step Count