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|a Yoshimura, Tetsuzo.
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1 |
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|a Self-Organized 3D Integrated Optical Interconnects :
|b With All-Photolithographic Heterogeneous Integration /
|c Tetsuzo Yoshimura.
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|a Singapore :
|b Jenny Stanford Publishing,
|c [2021]
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| 300 |
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|a 1 online resource (381 pages)
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|a text
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|a computer
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|a Cover -- Half Title -- Title Page -- Copyright Page -- Dedication -- Table of Contents -- Preface -- Chapter 1: Introduction -- Chapter 2: Guidelines toward Self-Organized 3D Integrated Optical Interconnects -- 2.1: Advantages of Lightwave Implementation into Boxes of Computers -- 2.2: Integrated Optical Interconnects -- 2.3: Self-Organization of 3D Integrated Optical Interconnects -- 2.4: E-O and O-E Signal Conversion in Integrated Optical Interconnects -- 2.5: Core Technologies for Self-Organized 3D Integrated Optical Interconnects -- Chapter 3: Scalable Film Optical Link Modules
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|a 3.1: Concept of S-FOLM -- 3.2: 3D Integrated Optical Interconnects Built by S-FOLMs -- 3.2.1: 3D OE Platforms -- 3.2.2: Structures within Boxes of Computers -- 3.3: Various OE Structures Built by S-FOLMs -- 3.3.1: OE-Film/Electrical Substrate Stack -- 3.3.2: OE-Film/OE-Film Stack and Backside Connection -- 3.3.3: Both-Side Mounting -- 3.3.4: Micro Optical Link Module -- 3.3.5: OE Tap Guide -- 3.3.6: WDM Transceiver and WDM Inter-PCB Connect -- 3.3.7: 3D Optical Circuits for WDM -- 3.4: Optoelectronic Amplifier/Driver-Less Substrate -- 3.4.1: Concept of OE-ADLES
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|a 3.4.2: Power Dissipation and RC Delay in OE-ADLES -- Chapter 4: Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits -- 4.1: Built-In Mask Method -- 4.2: Fabrication of Optical Waveguides and Vertical Mirrors -- 4.2.1: Waveguide Cores -- 4.2.2: Vertical Mirrors -- 4.3: Vertical Mirrors with Multi-Core-Layer Skirt-Type Structures -- 4.3.1: Observation of Beam Leakage and Scattering at Vertical Mirrors -- 4.3.2: Three-Core-Layer Skirt-Type Vertical Mirrors -- 4.3.3: Simulations of Beam Leakage/Scattering at Vertical Mirrors
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|a 4.3.4: Fabrication of Multi-Core-Layer Skirt-Type Vertical Mirrors -- 4.4: 3D Optical Circuits -- 4.4.1: Structures -- 4.4.2: Type I: Stacked Waveguide Films with Vertical Mirrors -- 4.4.2.1: Demonstration of 3D optical wiring -- 4.4.2.2: Loss measurements -- 4.4.2.3: Loss at Optical Z-Connection -- 4.4.3: Type II: Waveguide Films with Vertical Waveguides -- 4.5: Optical Waveguide Films Stacked on Electrical Boards -- 4.5.1: Process Flow -- 4.5.2: Waveguide-Film Stacking on PCBs -- 4.6: Nanoscale Waveguides Made of PRI Sol-Gel Thin Films -- 4.6.1: Linear, Bending, and Branching Waveguides
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|a 4.6.1.1: Fabrication processes -- 4.6.1.2: Linear waveguides -- 4.6.1.3: Bending and branching waveguides -- 4.6.2: Vertical Mirrors and All-Air-Cladding Waveguides -- Chapter 5: Resource-Saving All-Photolithographic Heterogeneous Integration: PL-Pack with SORT -- 5.1: Advantages of PL-Pack with SORT over Conventional Packaging -- 5.2: PL-Pack with SORT -- 5.2.1: Whole Process Flow of PL-Pack with SORT -- 5.2.2: Process Flow of SORT -- 5.3: Impacts of PL-Pack with SORT -- 5.3.1: Material Consumption and Costs -- 5.3.2: Mechanical Properties -- 5.3.3: Transfer Step Count
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|a 5.3.4: Small/Thin-Die Placement Density.
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|a Online resource; title from digital title page (viewed on April 05, 2021).
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|a Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve short line distances of the cm-mm order and large line counts of hundreds-thousands. This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
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|a Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.
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| 650 |
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|a Optical interconnects.
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| 650 |
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|a Interconnexions optiques.
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| 650 |
|
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|a Optical interconnects
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|a Electronic books.
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|a Taylor & Francis.
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| 758 |
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|i has work:
|a Self-Organized 3D Integrated Optical Interconnects (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCGV4JMMrHxTJpJxhXddBWC
|4 https://id.oclc.org/worldcat/ontology/hasWork
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|i Print version:
|a Yoshimura, Tetsuzo.
|t Self-Organized 3D Integrated Optical Interconnects : With All-Photolithographic Heterogeneous Integration.
|d Milton : Jenny Stanford Publishing, ©2021
|z 9789814877046
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