Self-Organized 3D Integrated Optical Interconnects : With All-Photolithographic Heterogeneous Integration /
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete...
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| Format: | eBook |
| Language: | English |
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Singapore :
Jenny Stanford Publishing,
[2021]
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| Online Access: | Connect to the full text of this electronic book |
| Summary: | Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve short line distances of the cm-mm order and large line counts of hundreds-thousands. This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects. |
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| Item Description: | 5.3.4: Small/Thin-Die Placement Density. |
| Physical Description: | 1 online resource (381 pages) |
| ISBN: | 9781000064629 100006462X 9781000064605 1000064603 9781003043058 1003043054 9781000064612 1000064611 |