Electronic packaging materials and their properties /

Bibliographic Details
Corporate Author:	Taylor & Francis
Other Authors:	Pecht, Michael
Format:	eBook
Language:	English
Published:	Boca Raton : CRC Press, ©1999.
Series:	Electronic packaging series.
Subjects:	Electronic packaging > Materials. Mise sous boîtier (Électronique) > Matériaux. TECHNOLOGY & ENGINEERING > Mechanical. Electronic packaging > Materials Elektronik Werkstoff Eletronica digital. Electronic books.
Online Access:	Connect to the full text of this electronic book

Table of Contents:

1. Properties of electronic packaging materials. 1.1. Electrical properties. 1.2. Thermal and thermomechanical properties. 1.3. Mechanical properties. 1.4. Chemical properties. 1.5. Miscellaneous properties
2. Zeroth-level packaging materials. 2.1. Semiconductors. 2.2. Attachment materials. 2.3. Substrates materials
3. First-level packaging materials. 3.1. Wire interconnects. 3.2. Tape interconnects. 3.3. Case materials. 3.4. Lid seals. 3.5. Leads
4. Second-level packaging materials. 4.1. Reinforcement fiber materials. 4.2. Resins. 4.3. Laminates. 4.4. Constraining cores. 4.5. Flexible wiring board materials. 4.6. Conformal coatings
5. Third-level packaging materials. 5.1. Backpanel materials. 5.2. Connector materials. 5.3. Cables and flex circuit materials
6. Summary.