Electronic packaging materials and their properties /

Electronic packaging science and technology /
by: Tu, K. N. (King-Ning), 1937-, et al.
Published: (2022)

Polymeric materials for electronics packaging and interconnection : developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988 /
Published: (1989)

The electronic packaging handbook /
Published: (2000)

Proceedings /

Proceedings of 2nd Electronic Packaging Technology Conference : [8-10 December, 1998, Raffles City Convention Center, Singapore] /
Published: (1998)

Hermeticity of electronic packages /
by: Greenhouse, Hal
Published: (2000)

Handbook of electronic package design /
Published: (1991)

Characterization of integrated circuit packaging materials /
Published: (1993)

Hermeticity of electronic packages /
by: Greenhouse, Hal
Published: (2012)

Advances in electronic circuit packaging.

Advances in electronic circuit packaging ; : proceedings /
Published: (1965)

Embedded Systems Design with 8051 Microcontrollers : Hardware and Software /
Published: (1999)

Lead-free soldering in electronics : science, technology and environmental impact /
Published: (2004)

Thermomechanical simulation methodologies for advanced semiconductor packaging /
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)

Thermomechanical simulation methodologies for advanced semiconductor packaging /
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)

Thermomechanical simulation methodologies for advanced semiconductor packaging /
by: Zhang, Shuye (Associate professor), et al.
Published: (2025)

Modern electronic materials.
by: Watkins, John, B.Sc
Published: (1971)

Introduction to microsystem packaging technology /
by: Jin, Yufeng
Published: (2011)

Microwave and millimeter-wave electronic packaging /
by: Sturdivant, Rick
Published: (2014)

Adhesives technology for electronic applications : materials, processes, reliability /
by: Licari, James J., 1930-
Published: (2005)

Semiconductor Packaging : Materials Interaction and Reliability.
by: Chen, Andrea
Published: (2011)

Mechanical analysis of electronic pakaging systems /
by: McKeown, Stephen A.
Published: (1999)

IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro Optics Society.
Published: (1999)

Ceramic interconnect technology handbook /
Published: (2007)

Semiconductor packaging : materials interaction and reliability /
by: Chen, Andrea
Published: (2011)

Thermal and structural electronic packaging analysis for space and extreme environments /
by: Cepeda-Rizo, Juan, et al.
Published: (2022)

Electronic packaging : materials and their properties /
Published: (1999)

Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A. /
Published: (1985)

Heat transfer : thermal management of electronics /
by: Shabany, Younes
Published: (2010)

Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A. /
Published: (1997)

Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A. /
Published: (1991)

Newnes electronics assembly handbook /
by: Brindley, Keith
Published: (1990)

Electronic packaging materials science II : symposium held April 15-18, 1986, Palo Alto, California, U.S.A. /
Published: (1986)

Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A. /
Published: (1988)

Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A. /
Published: (1998)

Electronic packaging materials science IV : symposium held April 24-28, 1989, San Diego, California, U.S.A. /
Published: (1989)