| Tag |
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| LEADER |
00000cam a2200000 i 4500 |
| 001 |
in00005520004 |
| 006 |
m o d |
| 007 |
cr cnu---unuuu |
| 008 |
180103s1999 flua ob 001 0 eng d |
| 005 |
20241108165449.5 |
| 035 |
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|a (OCoLC)on1017736932
|
| 040 |
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|a N$T
|b eng
|e rda
|e pn
|c N$T
|d OCLCO
|d YDX
|d NLE
|d OCLCQ
|d EZ9
|d OCLCA
|d OCLCQ
|d WYU
|d AU@
|d UKAHL
|d OCLCQ
|d INARC
|d OCLCF
|d OCLCQ
|d K6U
|d OCLCO
|d SFB
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCL
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| 015 |
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|a GBB814711
|2 bnb
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| 019 |
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|a 1017580855
|a 1047541064
|a 1058232506
|a 1066425879
|a 1097130094
|a 1148920674
|a 1260362869
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| 020 |
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|a 9781315214153
|q (electronic bk.)
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| 020 |
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|a 1315214156
|q (electronic bk.)
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| 020 |
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|a 9781351830041
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| 020 |
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|a 135183004X
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| 020 |
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|z 0849396255
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| 020 |
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|z 9780849396250
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| 035 |
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|a (OCoLC)1017736932
|z (OCoLC)1017580855
|z (OCoLC)1047541064
|z (OCoLC)1058232506
|z (OCoLC)1066425879
|z (OCoLC)1097130094
|z (OCoLC)1148920674
|z (OCoLC)1260362869
|
| 037 |
|
|
|a 9781351830041
|b Ingram Content Group
|
| 050 |
|
4 |
|a TK7870.15
|b .E4222 1999eb
|
| 072 |
|
7 |
|a TEC
|x 009070
|2 bisacsh
|
| 082 |
0 |
4 |
|a 621.381/046
|2 22
|
| 084 |
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|a UQ 8200
|2 rvk
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| 084 |
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|a ZN 3400
|2 rvk
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| 049 |
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|a TXAM
|
| 245 |
0 |
0 |
|a Electronic packaging materials and their properties /
|c Michael G. Pecht [and others].
|
| 264 |
|
1 |
|a Boca Raton :
|b CRC Press,
|c ©1999.
|
| 300 |
|
|
|a 1 online resource (114 pages) :
|b illustrations
|
| 336 |
|
|
|a text
|b txt
|2 rdacontent
|
| 337 |
|
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|a computer
|b c
|2 rdamedia
|
| 338 |
|
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|a online resource
|b cr
|2 rdacarrier
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| 490 |
1 |
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|a The electronic packaging series
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| 504 |
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|a Includes bibliographical references (pages 109-112) and index.
|
| 588 |
0 |
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|a Print version record.
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| 505 |
0 |
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|a 1. Properties of electronic packaging materials. 1.1. Electrical properties. 1.2. Thermal and thermomechanical properties. 1.3. Mechanical properties. 1.4. Chemical properties. 1.5. Miscellaneous properties -- 2. Zeroth-level packaging materials. 2.1. Semiconductors. 2.2. Attachment materials. 2.3. Substrates materials -- 3. First-level packaging materials. 3.1. Wire interconnects. 3.2. Tape interconnects. 3.3. Case materials. 3.4. Lid seals. 3.5. Leads -- 4. Second-level packaging materials. 4.1. Reinforcement fiber materials. 4.2. Resins. 4.3. Laminates. 4.4. Constraining cores. 4.5. Flexible wiring board materials. 4.6. Conformal coatings -- 5. Third-level packaging materials. 5.1. Backpanel materials. 5.2. Connector materials. 5.3. Cables and flex circuit materials -- 6. Summary.
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| 520 |
1 |
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|a "The effectiveness with which an electronic system performs its electrical functions, as well as the reliability and cost of the system, are strongly determined not only by the electrical design, but also by the packaging materials. Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system." "This book provides material information based on electronic packaging architectures, including semiconductor materials, materials used to interconnect and package the device, interconnection materials for component attachment to a substrate, materials used to fabricate a printed wiring board, and the interconnections and hardware required to realize an electronics system; reviews critical electrical, thermal, mechanical, and chemical properties of all the electronic packaging materials; and identifies and presents quality and reliability issues associated with electronic packaging materials."--Jacket.
|
| 650 |
|
0 |
|a Electronic packaging
|x Materials.
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| 650 |
|
6 |
|a Mise sous boîtier (Électronique)
|x Matériaux.
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Mechanical.
|2 bisacsh
|
| 650 |
|
7 |
|a Electronic packaging
|x Materials
|2 fast
|
| 650 |
|
7 |
|a Elektronik
|2 gnd
|
| 650 |
|
7 |
|a Werkstoff
|2 gnd
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| 650 |
|
7 |
|a Eletronica digital.
|2 larpcal
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| 655 |
|
7 |
|a Electronic books.
|2 local
|
| 700 |
1 |
|
|a Pecht, Michael.
|
| 710 |
2 |
|
|a Taylor & Francis.
|
| 758 |
|
|
|i has work:
|a Electronic packaging materials and their properties (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCGTkBm7vyb9mgh43X44QFX
|4 https://id.oclc.org/worldcat/ontology/hasWork
|
| 776 |
0 |
8 |
|i Print version:
|t Electronic packaging materials and their properties.
|d Boca Raton : CRC Press, ©1999
|z 0849396255
|w (DLC) 98034479
|w (OCoLC)39485340
|
| 830 |
|
0 |
|a Electronic packaging series.
|
| 856 |
4 |
0 |
|u http://proxy.library.tamu.edu/login?url=https://www.taylorfrancis.com/books/9781315214153
|z Connect to the full text of this electronic book
|t 0
|
| 955 |
|
|
|a Taylor and Francis ENGnetBASE
|
| 994 |
|
|
|a 92
|b TXA
|
| 999 |
f |
f |
|s bd7f85f0-8763-408b-bf5d-e39173803eb4
|i 26c7f139-dae2-4675-9947-dd08c2d3b6ca
|t 0
|
| 952 |
f |
f |
|a Texas A&M University
|b College Station
|c Electronic Resources
|s www_evans
|d Available Online
|t 0
|e TK7870.15 .E4222 1999eb
|h Library of Congress classification
|
| 998 |
f |
f |
|a TK7870.15 .E4222 1999eb
|t 0
|l Available Online
|