http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
1 online resource (1 volume (various pagings)) : illustrations.
Annotation Intended for practicing electrical engineers, this reference examines the various technologies associated with VLSI systems. It describes VLSI processes, semiconductor technology, micromachining, microelectronics packaging, compound semiconductor digital ICs, and multicap modules. Stressing the relationship between theory and practical application, it illustrates key points with examples while omitting complex proofs. Recent innovations and progress in SiGE, SiC, SOI, noise, materials, and logic design are given particular attention. Annotation (c)2003 Book News, Inc., Portland, OR (booknews.com).
Front Cover; Preface; Editor-in-Chief; Contributors; Contents; 1. VLSI Technology: A System Perspective; 2. CMOS/BiCMOS Technology; 3. Bipolar Technology; 4. Silicon on Insulator Technology; 5. SiGe Technology; 6. SiC Technology; 7. Passive Components; 8. Power IC Technologies; 9. Noise in VLSI Technologies; 10. Micromachining; 11. Microelectronics Packaging; 12. Multichip Module Technologies; 13. Channel Hot Electron Degradation-Delay in MOS Transistors Due to Deuterium Anneal; 14. Materials; 15. Compound Semiconductor Devices for Digital Circuits.
Includes bibliographical references and index.
Principles and applications in engineering ; 8