Polymer materials for electronic applications : based on a symposium sponsored by the Division of Organic Coatings and Plastics Chemistry at the second chemical congress of the North American continent (180th ACS national meeting), Las Vegas, Nevada, August 26-27, 1980 /
| Corporate Authors: | , , |
|---|---|
| Other Authors: | , |
| Format: | Conference Proceeding eBook |
| Language: | English |
| Published: |
Washington, D.C. :
American Chemical Society,
1982.
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| Series: | ACS symposium series ;
184. |
| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
Table of Contents:
- A sensitive positive-working cross-linked methacrylate electron resist / E.D. Roberts
- Radiation degradation and film solubility rates of poly(butene-1-sulfone) / Larry Stillwagon
- Poly(methyl methacrylate-co-3-oximino-2-butanone methacrylate-co-methacrylonitrile) : a deep-UV photoresist / E. Reichmanis and C.W. Wilkins, Jr.
- Compositional analysis of a terpolymer photoresist by raman spectroscopy / F.J. Purcell, E. Russavage, E. Reichmanis, and C.W. Wilkins, Jr.
- Effect of composition on resist dry-etching susceptibility : vinyl polymers and photoresists / J.N. Helbert and M.A. Schmidt
- Poly(N-alkyl-o-nitroamides) : a new class of thermally stable, photosensitive polymers / S.A. MacDonald and C.G. Willson
- A new approach to high-resolution lithography based on conducting organic charge transfer salts / E.M. Engler, Y. Tomkiewicz, J.D. Kuptsis, R.G. Schad, V.V. Patel, and M. Hatzakis
- Polyimide for multilevel very large-scale integration (VLSI) / Gay Samuelson
- Polyimide coatings for microelectronic applications / Y.K. Lee and J.D. Craig
- Development of polyimide isoindoloquinazolinedione in multilevel interconnections for large-scale integration (LSI) / Atsushi Saiki, Kiichiro Mukai, Seiki Harada, and Yasuo Miyadera
- Characterizing polyimide films for semiconductor application / A.M. Wilson, D. Laks, and S.M. Davis
- Implications of electronic and ionic conductivities of polyimide films in integrated circuit fabrication / George A. Brown
- Improved room-temperature vulcanized (RTV) silicone elastomers as integrated circuit (IC) encapsulants / Ching-Ping Wong
- Synthesis and properties of branched epoxy resins / Jon F. Geibel
- Characterization of cured epoxy powder coatings by solvent absorption / W.A. Romanchick and J.F. Geibel
- Thermal degradation of polymers for molded integrated circuit (IC) devices : the effect of a flame retardant / R.M. Lum and L.G. Feinstein
- Electrical switching and memory phenomena in semiconducting organic thin films / R.S. Potember and T.O. Poehler.