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Through-Silicon Vias for 3D Integration /

Bibliographic Details
Main Author:	Lau, John H. (Author)
Corporate Author:	McGraw-Hill Companies
Format:	eBook
Language:	English
Language Notes:	In English.
Published:	New York, N.Y. : McGraw-Hill Education, [2013]
Edition:	First edition.
Series:	McGraw-Hill's AccessEngineering.
Subjects:	Three-dimensional integrated circuits. Electronic books.
Online Access:	Connect to the full text of this electronic book

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