Cover Image

Through-Silicon Vias for 3D Integration /

Bibliographic Details
Main Author: Lau, John H. (Author)
Corporate Author: McGraw-Hill Companies
Format: eBook
Language:English
Language Notes:In English.
Published: New York, N.Y. : McGraw-Hill Education, [2013]
Edition:First edition.
Series:McGraw-Hill's AccessEngineering.
Subjects:
Three-dimensional integrated circuits.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Abstract:This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
Physical Description:1 online resource (xxiv, 487 pages) : illustrations.
Also available in print edition.
Format:Mode of access: Internet via World Wide Web.
Bibliography:Includes bibliographical references and index.
ISBN:9780071785143 (print-ISBN)
0071785140 (print-ISBN)