APA (7th ed.) Citation

Lau, J. H. (2013). Through-Silicon Vias for 3D Integration (First edition.). McGraw-Hill Education.

Chicago Style (17th ed.) Citation

Lau, John H. Through-Silicon Vias for 3D Integration. First edition. New York, N.Y.: McGraw-Hill Education, 2013.

MLA (9th ed.) Citation

Lau, John H. Through-Silicon Vias for 3D Integration. First edition. McGraw-Hill Education, 2013.