rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Reliability of RoHS-Compliant 2D and 3D IC interconnects
  name:
    name part: Lau, John H.
    role:
      role term: creator
    role:
      role term: author.
  name:
    name part: McGraw-Hill Companies
  type of resource: text
  genre: Electronic books.
  origin info:
    place:
      place term: nyu
    date issued: 2011
    edition: First edition.
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xxix, 606 pages) : illustrations.
  abstract: "Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This authoritative guide aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products. Reliability of RoHS-Compliant 2D and 3D IC Interconnects Covers chip-level interconnect reliability, first- and second-level interconnect reliability, and 3D IC integration interconnect reliability Addresses challenging problems created by increasing interest in lead-free interconnect reliability of 3D packaging and 3D IC integration Provides information fundamental to research and development of design (mechanical, optical, electrical, and thermal); materials; process; manufacturing; testing; and reliability for lead-free interconnects in RoHS-compliant electronics products Removes road blocks to, avoids unnecessary false starts in, and accelerates design, materials, and process development in packaging technology In-depth details: Introduction to RoHS Compliant Semiconductor and Packaging Technologies; Reliability Engineering of Lead-Free Interconnects; Notes on Failure Criterion; Reliability of 1657-Pin CCGA Lead-Free Solder Joints; Reliability of PBGA Lead-Free Solder Joints; Reliability of LED Lead-Free Interconnects; Reliability of VCSEL Lead-Free Interconnects; Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints; Reliability of Lead-Free (SACX) Solder Joints; Chip-to-Wafer (C2W) Lead-Free Interconnect Reliability; Wafer-to-Wafer (W2W) Lead-Free Interconnect Reliability; Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect Reliability; Electromigration of Lead-Free Microbumps for 3D IC Integrations; Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test Results; Effects of High S…
  abstract: "Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive coverage of RoHS-compliant electronics packaging solder interconnects. RoHS--the restriction of the use of certain hazardous substances in electrical and electronic equipment--is law in the EU, China, Japan, Korea, Canada, Australia, California, etc. RoHS bans lead and five other materials; thus, in order to ship electrical products to these regions and countries, products must be lead-free. The material in this book aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products"--Provided by publisher.
  table of contents: Introduction to RoHS-compliant semiconductor and packaging technologies. Reliability engineering of lead-free interconnects. Notes on failure criteria. Reliability of 1657-Pin CCGA lead-free solder joints. Reliability of PBGA lead-free solder joints (with and without Underfills). Reliability of LED lead-free interconnects. Reliability of VCSEL lead-free interconnects. Reliability of low-temperature lead-free (SnBiAg) solder joints. Reliability of lead-free (SACX) solder joints. Chip-to-wafer (C2W) bonding and lead-free interconnect reliability. Wafer-to-wafer (W2W) bonding and lead-free interconnect reliability. Through-silicon-via (TSV) interposer reliability. Electromigration of lead-free microbumps for 3-D IC integration. Effects of dwell[-] time and ramp[-] rate[s] on SAC thermal cycling test results. Effects of high strain rate (impact) on SAC solder balls/bumps. Effects of voids on solder joint[s] reliability.
  note: John H. Lau.
  note: Print version c2011.
  note: Also available in print edition.
  note: Electronic reproduction. New York, N.Y. : McGraw Hill, 2011. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.
  note: Mode of access: Internet via World Wide Web.
  note: Includes bibliographical references and index.
  note: In English.
  subject:
    topic: Interconnects (Integrated circuit technology)
    topic: Reliability
  subject:
    topic: Green technology
    topic: Reliability
  classification: TK7874.53
  classification: 621.381/046
  related item:
    title info:
      title: Introduction to RoHS-compliant semiconductor and packaging technologies
  related item:
    title info:
      title: Reliability engineering of lead-free interconnects
  related item:
    title info:
      title: Notes on failure criteria
  related item:
    title info:
      title: Reliability of 1657-Pin CCGA lead-free solder joints
  related item:
    title info:
      title: Reliability of PBGA lead-free solder joints (with and without Underfills)
  related item:
    title info:
      title: Reliability of LED lead-free interconnects
  related item:
    title info:
      title: Reliability of VCSEL lead-free interconnects
  related item:
    title info:
      title: Reliability of low-temperature lead-free (SnBiAg) solder joints
  related item:
    title info:
      title: Reliability of lead-free (SACX) solder joints
  related item:
    title info:
      title: Chip-to-wafer (C2W) bonding and lead-free interconnect reliability
  related item:
    title info:
      title: Wafer-to-wafer (W2W) bonding and lead-free interconnect reliability
  related item:
    title info:
      title: Through-silicon-via (TSV) interposer reliability
  related item:
    title info:
      title: Electromigration of lead-free microbumps for 3-D IC integration
  related item:
    title info:
      title: Effects of dwell[-] time and ramp[-] rate[s] on SAC thermal cycling test results
  related item:
    title info:
      title: Effects of high strain rate (impact) on SAC solder balls/bumps
  related item:
    title info:
      title: Effects of voids on solder joint[s] reliability
  related item:
    title info:
      title: Reliability of RoHS-Compliant 2D and 3D IC interconnects
    origin info:
      publisher: New York, N.Y. : McGraw-Hill Education, 2011
      edition: First edition.
    identifier: (OCoLC)659763935
  related item:
    title info:
      title: McGraw-Hill's AccessEngineering
  identifier: 0071773339
  identifier: 9780071753791
  identifier: 2010040873
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: IN-ChSCO
    record creation date: 210416
    record change date: 20241008175927.7
    record identifier: in00005504534
    language of cataloging:
      language term: eng