Cover Image

3D IC integration and packaging /

Bibliographic Details
Main Author: Lau, John H. (Author)
Corporate Author: McGraw-Hill Companies
Format: eBook
Language:English
Language Notes:In English.
Published: New York, N.Y. : McGraw-Hill Education, [2016]
Edition:First edition.
Series:McGraw-Hill's AccessEngineering.
Subjects:
Three-dimensional integrated circuits.
Microelectronic packaginga.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Abstract:A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications.
Physical Description:1 online resource (xxii, 458 pages) : illustrations.
Also available in print edition.
Format:Mode of access: Internet via World Wide Web.
Bibliography:Includes bibliographical references and index.
ISBN:9780071848060 (print-ISBN)
0071848061 (print-ISBN)