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Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
1 online resource (849 pages) : 550 illustrations.
Cover -- Title Page -- Copyright Page -- Dedication -- Contents -- Contributors -- Preface -- 1 Introduction to Device and Systems Packaging Technologies -- 1.1 What Is Packaging and Why? -- 1.2 Anatomy of an Electronic Packaged System from a Packaging Point of View -- 1.3 Devices and Moore?s Law -- 1.4 Electronic Technology Waves: Microelectronics, RF/Wireless, Photonics, MEMS, and Quantum Devices -- 1.5 Packaging and Moore?s Law for Packaging -- 1.6 Electronic Systems Technologies Trends -- 1.7 Future Outlook -- 1.8 How the Book Is Organized -- 1.9 Homework Problems -- 1.10 Suggested Reading -- Part 1 Fundamentals of Packaging -- 2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference -- 3 Fundamentals of Thermal Technologies -- 4 Fundamentals of Thermo-Mechanical Reliability -- 5 Fundamentals of Package Materials at Microscale and Nanoscale -- 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates -- 7 Fundamentals of Passive Components and Integration with Active Devices -- 8 Fundamentals of Chip-to-Package Interconnections and Assembly -- 9 Fundamentals of Embedded and Fan-Out Packaging -- 10 Fundamentals of 3D Packaging with and without TSV -- 11 Fundamentals of RF and Millimeter-Wave Packaging -- 12 Fundamentals of Optoelectronics Packaging -- 13 Fundamentals of MEMS and Sensor Packaging -- 14 Fundamentals of Package Encapsulation, Molding, and Sealing -- 15 Fundamentals of Printed Wiring Boards -- 16 Fundamentals of Board Assembly -- Part 2 Applications of Packaging Technologies -- 17 Applications of Packaging Technologies in Future Car Electronics -- 18 Applications of Packaging Technologies in Bioelectronics -- 19 Applications of Packaging Technologies in Communication Systems -- 20 Applications of Packaging Technologies in Computing Systems -- 21 Applications of Packaging Technologies in Flexible Electronics -- 22 Applications of Packaging Technologies in Smartphones -- Index.
Electronic reproduction. New York, N.Y. : McGraw Hill, 2019. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.
Mode of access: Internet via World Wide Web.
Includes bibliographical references and index.
Fundamentals of Device and Systems Packaging: Technologies and Applications