rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
  name:
    name part: Tummala, Rao
    role:
      role term: creator
    role:
      role term: author.
  name:
    name part: McGraw-Hill Companies
  type of resource: text
  genre: Electronic books.
  origin info:
    place:
      place term: nyu
    date issued: 2019
    edition: 2nd edition.
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (849 pages) : 550 illustrations.
  table of contents: Cover -- Title Page -- Copyright Page -- Dedication -- Contents -- Contributors -- Preface -- 1 Introduction to Device and Systems Packaging Technologies -- 1.1 What Is Packaging and Why? -- 1.2 Anatomy of an Electronic Packaged System from a Packaging Point of View -- 1.3 Devices and Moore?s Law -- 1.4 Electronic Technology Waves: Microelectronics, RF/Wireless, Photonics, MEMS, and Quantum Devices -- 1.5 Packaging and Moore?s Law for Packaging -- 1.6 Electronic Systems Technologies Trends -- 1.7 Future Outlook -- 1.8 How the Book Is Organized -- 1.9 Homework Problems -- 1.10 Suggested Reading -- Part 1 Fundamentals of Packaging -- 2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference -- 3 Fundamentals of Thermal Technologies -- 4 Fundamentals of Thermo-Mechanical Reliability -- 5 Fundamentals of Package Materials at Microscale and Nanoscale -- 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates -- 7 Fundamentals of Passive Components and Integration with Active Devices -- 8 Fundamentals of Chip-to-Package Interconnections and Assembly -- 9 Fundamentals of Embedded and Fan-Out Packaging -- 10 Fundamentals of 3D Packaging with and without TSV -- 11 Fundamentals of RF and Millimeter-Wave Packaging -- 12 Fundamentals of Optoelectronics Packaging -- 13 Fundamentals of MEMS and Sensor Packaging -- 14 Fundamentals of Package Encapsulation, Molding, and Sealing -- 15 Fundamentals of Printed Wiring Boards -- 16 Fundamentals of Board Assembly -- Part 2 Applications of Packaging Technologies -- 17 Applications of Packaging Technologies in Future Car Electronics -- 18 Applications of Packaging Technologies in Bioelectronics -- 19 Applications of Packaging Technologies in Communication Systems -- 20 Applications of Packaging Technologies in Computing Systems -- 21 Applications of Packaging Technologies in Flexible Electronics -- 22 Applications of Packaging Technologies in Smartphones -- Index.
  note: Rao Tummala.
  note: Also available in print edition.
  note: Electronic reproduction. New York, N.Y. : McGraw Hill, 2019. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.
  note: Mode of access: Internet via World Wide Web.
  note: Includes bibliographical references and index.
  note: In English.
  subject:
    topic: Microelectronic packaging
  subject:
    topic: TECHNOLOGY & ENGINEERING / Electrical
  classification: TK7870.15
  classification: 621.381
  related item:
    title info:
      title: Fundamentals of Device and Systems Packaging: Technologies and Applications
    origin info:
      publisher: New York, N.Y. : McGraw Hill,
      edition: Second Edition,
    identifier: (OCLC)1124797429
  identifier: 9781259861567 (e-ISBN)
  identifier: 1259861562 (e-ISBN)
  identifier: 9781259861550 (print-ISBN)
  identifier: 1259861554 (print-ISBN)
  identifier: 2019944553
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: IN-ChSCO
    record creation date: 191023
    record change date: 20241008175915.9
    record identifier: in00005504373
    language of cataloging:
      language term: eng