Advanced MEMS packaging /
Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.
| Corporate Author: | |
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| Other Authors: | , , , |
| Format: | eBook |
| Language: | English |
| Language Notes: | In English. |
| Published: |
New York, N.Y. :
McGraw-Hill Education,
[2010]
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| Edition: | First edition. |
| Series: | McGraw-Hill's AccessEngineering.
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| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
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