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Advanced MEMS packaging /

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Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.

Bibliographic Details
Corporate Author: McGraw-Hill Companies
Other Authors: Lau, John H., Lee, Chengkuo, Premachandran, C. S., Aibin, Yu
Format: eBook
Language:English
Language Notes:In English.
Published: New York, N.Y. : McGraw-Hill Education, [2010]
Edition:First edition.
Series:McGraw-Hill's AccessEngineering.
Subjects:
Microelectromechanical systems.
Microelectronic packaging.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Summary:Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.
Item Description:Print version c2010.
Physical Description:1 online resource (xxiii, 552 pages) : illustrations.
Also available in print edition.
Format:Mode of access: Internet via World Wide Web.
Bibliography:Includes bibliographical references and index.
ISBN:0071741836
9780071626231