Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies /

"In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--Jacket.

Bibliographic Details
Main Author:	Martin, Perry L. (Author)
Corporate Author:	McGraw-Hill Companies
Other Authors:	Dylls, D. David, Medora, Noshirwan K., Le May, Ian, Ludwig, Lawrence L., Kaplan, Herbert, Kessler, L. W., Semmens, J. E., Roche, David J., Erickson, J. J., Devaney, John R., Van Westerhuyzen, Dennis H., Vettraino, L. G., Blanchard, Richard A., Galler, Donald, Glover, Duncan, Kusko, Alexander, Loud, John D., Mimmack, Gregory J., Slenski, George, Denson, William, Muller, Gunter, Dunbar, William G.
Format:	eBook
Language:	English
Language Notes:	In English.
Published:	New York, N.Y. : McGraw-Hill Education, [2000]
Edition:	First edition.
Series:	McGraw-Hill's AccessEngineering.
Subjects:	Electronic apparatus and appliances > Reliability. System failures (Engineering) Microelectronics. Semiconductors. Acoustic imaging. Infrared photography. Electron microscopy. X-ray microscopy. Metallography. Semiconductors > Defects. Solder and soldering. Printed circuits. Electronic apparatus and appliances > Defects. Electronics > Materials > Defects. Electronic books.
Online Access:	Connect to the full text of this electronic book

Table of Contents:

Pt. 1. Introduction to electronic failure analysis
part 2. Electronic failiure analysis techniques
part 3. Electronic failure analysis for specific technologies.
Ch. 1. Overview of electronic component reliability
chapter 2. Overview of electronic systems reliability
chapter 3. Product liability
chapter 4. Photography and optical microscopy
chapter 5. X-ray/radiographic component inspection
chapter 6. Infrared thermography
chapter 7. Acoustic micro imaging failure analysis of electronic devices
chapter 8. Metallography
chapter 9. Chemical characterization
chapter 10. Electronic and electrical characterization
chapter 11. Scanning electron microscopy and x-ray analysis
chapter 12. Miscellaneous techniques
chapter 13. Solder joints
chapter 14. Failure analysis of printed wiring assemblies
chapter 15. Wires and cables
chapter 16. Switches and relays
chapter 17. Connection technology
chapter 18. Failure analysis of components
chapter 19. Semiconductors
chapter 20. Power and high-voltage considerations.