rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Electronic materials and processes handbook
  name:
    name part: Harper, Charles A.
  name:
    name part: Cohn, Charles.
  name:
    name part: Schoch, Karl F.
  name:
    name part: Bailey, Alan E.
  name:
    name part: Gardner, J. Donald.
  name:
    name part: Hwang, Jennie S.
  name:
    name part: McChesney, Mike.
  name:
    name part: Carano, Michael.
  name:
    name part: Fjelstad, Joseph.
  name:
    name part: Sergent, Jerry E.
  name:
    name part: Toleno, Brian J.
  name:
    name part: Burns, Barry.
  name:
    name part: Marinelli, Christy.
  name:
    name part: Krum, Al.
  name:
    name part: McGraw-Hill Companies
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  genre: Internet resources.
  origin info:
    place:
      place term: nyu
    place:
      place term: New York
    publisher: McGraw-Hill
    date issued: [2003]
    date issued: 2003
    edition: 3rd ed.
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource: illustrations.
  table of contents:
    href: http://www.loc.gov/catdir/toc/mh031/2003046353.html
  target audience: specialized
  note: Charles A. Harper, editor in chief.
  note: Print version c2003.
  note: Also issued in print and PDF version.
  note: Includes bibliographical references and index.
  note: Contributor biographical information: http://www.loc.gov/catdir/bios/mh041/2003046353.html
  subject:
    topic: Electronics
    topic: Materials
  subject:
    topic: Electronic apparatus and appliances
    topic: Materials
  subject:
    topic: Integrated circuits
    topic: Design and construction
  subject:
    topic: Microelectronics
  subject:
    topic: Integrated circuits
    topic: Materials
  subject:
    topic: Electronic ceramics
  subject:
    topic: Electronic packaging
  subject:
    topic: Microelectronic packaging
  subject:
    topic: Printed circuits
  subject:
    topic: Electric insulators and insulation
    topic: Plastics
  subject:
    topic: Adhesives
  subject:
    topic: Solder and soldering
  subject:
    topic: Electronic apparatus and appliances
    topic: Temperature control
  classification: TK7836 .E4654 2003
  classification: 621.381
  related item:
    title info:
      title: Development and fabrication of IC chips
  related item:
    title info:
      title: Plastics, elastomers, and composites
  related item:
    title info:
      title: Ceramics and glasses
  related item:
    title info:
      title: Metals
  related item:
    title info:
      title: Solder technologies for electronic packaging and assembly
  related item:
    title info:
      title: Electroplating and deposited metallic coatings
  related item:
    title info:
      title: Printed circuit board fabrication
  related item:
    title info:
      title: Materials and processes for hybrid microelectronics and multichip modules
  related item:
    title info:
      title: Adhesives, underfills, and coatings in electonics assemblies
  related item:
    title info:
      title: Thermal management materials and systems
  related item:
    title info:
      title: McGraw-Hill's AccessEngineering
  identifier: 0071402144 (print)
  identifier: 0071450297
  identifier: 9780071402149
  identifier: 2003046353
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record creation date: 070424
    record change date: 20241008175829.0
    record identifier: in00005503812