http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Electronic materials and processes handbook
Includes bibliographical references and index.
Contributor biographical information: http://www.loc.gov/catdir/bios/mh041/2003046353.html
Solder technologies for electronic packaging and assembly
Electroplating and deposited metallic coatings
Materials and processes for hybrid microelectronics and multichip modules
Adhesives, underfills, and coatings in electonics assemblies
Thermal management materials and systems