Fundamentals of microsystems packaging /

"A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter.".

Bibliographic Details
Corporate Author:	McGraw-Hill Companies
Other Authors:	Tummala, Rao R., 1942-, Morris, James E., Davidson, Evan, Sarma, D. H. R., Hubbard, Bob, Rao, N. J., Swaminathan, Madhavan, Peterson, Andrew F., Kim, Juongho, Sitaraman, Suresh K., Pang, John H. L., Bar-Cohen, Avram, Watwe, Abhay, Seetharamu, Kankanhally N., Kamath, Sundar M., Charles, Harry K., Baldwin, David F., Garrou, Phil, Prymak, John, Bhattacharya, Swapan, Paik, Kyung, Cruz Rivera, Jose L., Gaylord, Thomas K., Glytsis, Elias N., Laskar, Joy, Tentzeris, Emmanouil M., Schutt-Aine, Jose E., Ramesham, Rajeshuni, Ghaffarian, Reza, Ayazi, Farrokh, Wong, C. P., Fang, Treliant, Varadarajan, Mahesh, Illyefalvi-Vitez, Zsolt, ZImmermann, Joachim, Mattsson, Fredrik, Kandelid, Stefan, Raj, Pulugurtha Markondeya, Liu, Johan, Ohlckers, Per, Keezer, David, Kim, Bruce, Koppolu, Sasidhar, May, Gary S., Shinotani, Ken-ichi, Malmodin, Jens, Trankell, Richard, Qu, Jianmin, Guo, Yifan
Format:	eBook
Language:	English
Language Notes:	In English.
Published:	New York, N.Y. : McGraw-Hill Education, [2001]
Edition:	First edition.
Series:	McGraw-Hill's AccessEngineering.
Subjects:	Electronic packaging. Microelectronic packaging. Miniature electronic equipment > Packaging. Electronic packaging > Design. Electronic apparatus and appliances > Temperature control. Chip scale packaging. Multichip modules (Microelectonics) Integrated circuits. Integrated circuits industry. Passive components. Integrated passive components. Optoelectronics. Radio frequency integrated circuits. Microelectromechanical systems. Sealing (Technology) Miniature electronic equipment (Bonding) Electronic apparatus and appliances > Plastic embedment. Electronics > Materials > Surfaces. Semiconductors > Surfaces. Printed circuits > Design and construction. Surface mount technology. Electronic packaging > Materials. Microelectronic packaging > Materials. Electronics > Testing. Microelectronics > Testing. Microelectronics > Design. Electronic apparatus and appliances > Reliability. Electronic books.
Online Access:	Connect to the full text of this electronic book

Published 2001

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