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Chiplet Design and Heterogeneous Integration Packaging /

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a...

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Bibliographic Details
Main Author: Lau, John H. (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Singapore : Springer Nature Singapore : Imprint: Springer, 2023.
Edition:1st ed. 2023.
Subjects:
Electronics.
Electronic circuits.
Microtechnology.
Microelectromechanical systems.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Microsystems and MEMS.
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • State-of-the-Art of Advanced Packaging
  • Chip Partition and Chip Split
  • Multiple System and Heterogeneous Integration with TSV Interposers
  • Multiple System and Heterogeneous Integration with TSV-Less Interposers
  • Chiplets Lateral (Horizontal) Communications
  • Cu-Cu Hybrid Bonding.