Flexible electronic packaging and encapsulation technology /

Bibliographic Details
Other Authors:	Meng, Hong (Editor), Huang, Wei (Editor)
Format:	eBook
Language:	English
Published:	Weinheim, Germany : Wiley-VCH, [2024]
Subjects:	Electronic packaging. Electronic books.
Online Access:	Connect to the full text of this electronic book

Table of Contents:

Cover
Title Page
Copyright
Contents
Preface
Chapter 1 Overview of Flexible Electronic Encapsulating Technology
1.1 Flexible Electronics Overview
1.2 Development of Flexible Electronic Encapsulating Technology
1.2.1 Flip Chip Process
1.2.2 Progress of CIF-Based Flexible Electronic Encapsulating Technology
1.3 Encapsulating Technology of Several Important Flexible Electronic Devices
1.3.1 Organic Light-Emitting Diode
1.3.2 Flexible Solar Cell Encapsulating
1.3.3 Flexible Amorphous Silicon Solar Cells
1.3.4 Flexible Perovskite Solar Cells
1.4 Flexible Electronic Encapsulating Materials
1.4.1 Selection Principle of Flexible Electronic Encapsulating Materials
1.4.2 Desirable Properties of Flexible Electronic Encapsulating Materials
1.5 Overview of the Development of Flexible Electronic Packaging at Home and Abroad
References
Chapter 2 Basic Concepts Related to Flexible Electronic Packaging
2.1 Composition of Flexible Electronic Packaging
2.1.1 Flexible Substrate
2.1.2 Electronic Components
2.1.3 Crosslinked Conductive Materials
2.1.4 Adhesive Layer
2.1.5 Coating Layer
2.2 Flexible Electronic Packaging Structure
2.2.1 Curved Structures of Hard Thin Films
2.2.2 Island-Bridge Structure
2.2.3 Pre-strained Super-Soft Interconnect Structure
2.2.4 Open Grid Structure
2.3 Encapsulation Principle
2.3.1 Basic Principle of Penetration
2.3.2 Permeation Mechanism of Water Vapor and Gas
2.3.3 Barrier Performance Measurement
2.3.4 Thin-Film Barrier Technology for Organic Devices
2.3.4.1 Single-Layer Film Package
2.3.4.2 Multilayer Film Packaging
2.3.5 Film Encapsulation Mechanics
2.4 Packaging Technology
2.4.1 Local Multilayer Packaging
2.4.2 Multilayer Barrier Film Packaging
2.4.3 Online Thin-Film Encapsulation
2.4.4 Atomic Layer Deposition (ALD) Encapsulation
2.4.5 Inkjet Packaging
2.4.6 Flexible Glass Packaging
2.5 Packaging Stability
2.6 Encapsulated Products
2.7 Chapter Summary
References
Chapter 3 Flexible Substrates
3.1 Concept and Connotation of Flexible Substrates
3.2 Development History of Flexible Substrates
3.3 Flexible Substrate Materials
3.3.1 Polydimethylsiloxane
3.3.2 Polyvinyl Alcohol
3.3.3 Polycarbonate
3.3.4 Polyester
3.3.5 Polyimide
3.3.6 Polyurethane
3.3.7 Parylene
3.3.8 Liquid Crystal Polymer
3.3.9 Hydrogel
3.4 Molding Technology of Flexible Substrate
3.4.1 Coating Technology
3.4.1.1 Dip Coating Method
3.4.1.2 Air Knife Coating Method
3.4.1.3 Scraper Coating Method
3.4.1.4 Rotary Coating Method
3.4.2 Melt Extrusion Molding
3.4.3 Melt Extrusion Blow Molding
3.4.4 Solution Tape Casting
3.4.5 Bidirectional Drawing Molding
3.4.6 Chemical Vapor Deposition
3.5 Performance Evaluation of Flexible Substrates
3.5.1 Mechanical Flexibility
3.5.2 Ductility