Flexible electronic packaging and encapsulation technology /

Bibliographic Details
Other Authors: Meng, Hong (Editor), Huang, Wei (Editor)
Format: eBook
Language:English
Published: Weinheim, Germany : Wiley-VCH, [2024]
Subjects:
Online Access:Connect to the full text of this electronic book
Description
Item Description:3.5.3 Adhesive Property
Physical Description:1 online resource (379 p.)
ISBN:9783527845729
3527845720
9783527845705
3527845704