| Abstract: | A novel method for making discretionary interconnections involves direct writing on wafer using a precision laser beam and metallization using the lift off process. After experimenting with several line thicknesses, developing times (for lift off), laser power densities and speeds, I succeeded in creating arbitrary interconnections from metal to metal, metal to diffusion and metal to polysilicon on a test structure. The feasibility of step coverage was also investigated. These results are extremely encouraging from a technical standpoint and recommendations are made which would improve this work through further research. |
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