rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Lead-free soldering process development and reliability
  name:
    name part: Bath, Jasbir
    role:
      role term: editor.
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  origin info:
    place:
      place term: nju
    date issued: 2020
    copyright date: 2020
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xxii, 481 pages) : illustrations
  abstract: "This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards. A practicing engineer will find the book of use as it goes into these and other topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Investigates high temperature, low temperature, and high reliability lead-free alloys. Describes the effects of intermetallic compound on reliability. Explains updates in lead-free rework technology including hand soldering, BGA rework, and PTH rework. Provides a guideline to going lead-free to industries that are complying with new environmental regulations, such as defense, aerospace, medical, and automotive industries"--
  note: edited by Jasbir Bath, Bath Consultancy LLC.
  note: Includes bibliographical references and index.
  subject:
    topic: Electronic packaging
  subject:
    topic: Solder and soldering
  classification: TK7870.15 .L434 2020
  classification: 621.381/046
  related item:
    title info:
      title: Lead-free soldering process development and reliability
    origin info:
      publisher: Hoboken, NJ : John Wiley & Sons, Inc., 2020.
      edition: First edition.
    identifier: (DLC) 2020004969
  related item:
    title info:
      title: Wiley series in quality and reliability engineering
  identifier: 9781119482093
  identifier: 1119482097
  identifier: 9781119481935
  identifier: 1119481937
  identifier: 9781119482048
  identifier: 1119482046
  identifier: 9781119482031
  identifier: 2020004970
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: DLC
    record creation date: 200131
    record change date: 20260214202747.5
    record identifier: in00004686083
    language of cataloging:
      language term: eng