Handbook of 3D Integration : Volume 3-3D Process Technology.

Bibliographic Details
Main Author:	Garrou, Philip
Other Authors:	Koyanagi, Mitsumasa, Ramm, Peter
Format:	eBook
Language:	English
Published:	Hoboken : Wiley, 2014.
Subjects:	Integrated circuits. Integrated circuits > Design and construction. Silicon. Three-dimensional imaging. Silicon Imaging, Three-Dimensional Electronic books.
Online Access:	Connect to the full text of this electronic book

Description
Item Description:	Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading fo.
Physical Description:	1 online resource (475 pages)
Bibliography:	Includes bibliographical references at the end of each chapters and index.
ISBN:	9783527670130 3527670130 9783527670123 3527670122 9783527670116 3527670114 9783527670109 3527670106