rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Microelectronics failure analysis
    sub title: desk reference
  name:
    name part: Gandhi, Tejinder
    role:
      role term: editor.
  name:
    name part: Knovel (Firm)
  name:
    name part: ASM International
    role:
      role term: issuing body.
  name:
    name part: Electronic Device Failure Analysis Society
    role:
      role term: contributor.
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  genre: Handbooks and manuals.
  origin info:
    place:
      place term: ohu
    date issued: 2019
    copyright date: 2019
    edition: Seventh edition.
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xi, 705 pages) : illustrations (some color)
  table of contents: Intro; 01_Overview of Wafer-level Electrical Failure_Pai inputs_addressed; 03_EDFAS Desk Reference Paper -- Susan Li -- 8-5-2019 -- Final; 04_Non-destructive Techniques for Advanced Board Level Failure Analysis; 05_EDFAS Desk Refrence -- FA Lab management article-final; 06_07A Optical Microscopy for Desk Reference 2010_corrected; 07_X-ray imaging tools for electronic device failure analysis_CSFinal_V4; 08_!PUB-2019_EDFAS_SAM_Update_Final-20190731; Acoustic Microscopy of Semiconductor Packages; Cheryl D. Hartfield; Carl Zeiss SMT Incorporated, Pleasanton, CA, USA; cheryl.hartfield@zeiss.com
  table of contents: Thomas M. MooreWaviks Incorporated, Dallas, TX, USA; tom.moore@waviks.com; Sebastian Brand; Fraunhofer IMWS, Halle, Germany; sebastian.brand@imws.fraunhofer.de; Introduction; History; The C-scan; The Stanford SAM; Today's SAM for IC Package Inspection; Early SAM Applications in the IC Industry; An Important Tool for Popcorn Crack Detection; Theoretical Considerations; Overview: Acoustic Microscopy for IC Package Inspection; Types of Reflected Signal Analysis Modes:; Polarity Analysis of Reflected Signals; Time of Flight Imaging Using Reflected Signals; Resolution and Sensitivity of SAM Inspection
  table of contents: Transducer SelectionContrast mechanisms in acoustic imaging; Focusing of acoustic waves; Practical Applications of Conventional SAM; Plastic Package Inspection; Inspection of Packages Having High Velocity Substrates; Strategies for Inspection of Packages Having Thin Layers; Imaging Flip Chip Devices; Complementary Nondestructive Techniques; Current Challenges and New Developments; Stacked Die Packages and Increasing 3D Structures; Signal Analysis in Acoustic Microscopy for Enhanced Defect Detection Capabilities; Spectral Analysis and Split-Spectrum Imaging (SSP); Automated Bump Inspection
  table of contents: Crack Detection by Multimode and Shear-Wave ImagingExtending Package Inspection Capability with Acoustic Ghz-Microscopy: Potential, Application and Challenges; GHz-SAM Imaging of Wirebond Interfaces and Bond Pads; GHz-SAM for the Inspection of Bonding Interfaces in Wafer Bonding; GHz-SAM Inspection for Void Formation in Metallization Lines for Automotive Applications; Inspection of TSVs Using Acoustic GHz-Microscopy; Photo-acoustic GHz-microscopy: an emerging technique?; Summary; Author Contributions; References; 09_04C Srikanth_Keim_Eide__Diagnosis; 010_aorozco-edfas-deskref-7th-ed-v16
  table of contents: 011_TDR_EOTPR_TDT_desk_reference_ASM_r4012_Frontsidefinal_9-3-2019; 013_Backside Preparation and Optics Revision4; 014_Corrected Photon emission article (1); 015_Beam fault isolation corrected; 016_Desk Ref_7thEdition_ Thermal detection_V7_new title_rev1; 017_Desk Ref_7thEdition_3DLIT_V6.1; 018_LADA_SDL_Desk_Reference_Final_Final; 019_Laser Voltage Probing Article -; 020_EDFAS_CAD_Navigation_Principles_7th-Ed; 021_05C MDR_Rosenkranz; 022_EDFAS. Transistor Characterization(Final)_8_30; 023_Fundamentals_Nanoprobe_Final; 024_Silicon Device
  note: edited by Tejinder Gandhi.
  note: "An ASM materials solutions publication."
  note: "EDFAS, Electronic Device Failure Analysis Society, ASM International."
  note: Includes bibliographical references and indexes.
  subject:
    topic: Electronics
    topic: Materials
    topic: Testing
    genre: Handbooks, manuals, etc
  subject:
    topic: Microelectronics
    topic: Materials
    topic: Testing
    genre: Handbooks, manuals, etc
  subject:
    topic: Microelectronics
    topic: Materials
    topic: Defects
    genre: Handbooks, manuals, etc
  subject:
    topic: Electronic apparatus and appliances
    topic: Testing
    genre: Handbooks, manuals, etc
  subject:
    topic: Semiconductors
    topic: Defects
    genre: Handbooks, manuals, etc
  subject:
    topic: Microélectronique
    topic: Défauts
    genre: Guides, manuels, etc
  subject:
    topic: Appareils électroniques
    topic: Essais
    genre: Guides, manuels, etc
  subject:
    topic: Semi-conducteurs
    topic: Défauts
    genre: Guides, manuels, etc
  subject:
    topic: Electronic apparatus and appliances
    topic: Testing
  subject:
    topic: Electronics
    topic: Materials
    topic: Testing
  subject:
    topic: Microelectronics
    topic: Materials
    topic: Defects
  subject:
    topic: Microelectronics
    topic: Materials
    topic: Testing
  subject:
    topic: Semiconductors
    topic: Defects
  classification: TK7871 .M52 2019
  classification: 621.381
  related item:
    title info:
      title: Microelectronics failure analysis
    origin info:
      publisher: Materials Park, Ohio : ASM International, 2019
      edition: Seventh edition.
    identifier: (DLC) 2019951107
    identifier: (OCoLC)1126332918
  identifier: 9781627082471
  identifier: 1627082476
  identifier: 9781627082464
  identifier: 1627082468
  identifier: 9781523126323
  identifier: 1523126329
  identifier: 9781627082457
  identifier: 162708245X
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: EBLCP
    record creation date: 191214
    record change date: 20230110224426.5
    record identifier: in00004639719
    language of cataloging:
      language term: eng