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Modeling, analysis, design, and tests for electronics packaging beyond Moore /

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Bibliographic Details
Main Authors: Zhang, Hengyun (Author), Che, Faxing (Author), Lin, Tingyu (Author), Zhao, Wensheng (Author)
Corporate Author: Knovel (Firm)
Format: eBook
Language:English
Published: Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]
Series:Woodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials.
Subjects:
Electronic apparatus and appliances > Packaging.
Appareils électroniques > Emballage.
Electronic books.
Online Access:Connect to the full text of this electronic book

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