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The Technology of Wafers and Waffles: Operational AspectsïÅ½is the definitive reference book on wafer and waffle technology and manufacture. It covers specific ingredient technology (including water quality, wheat flour, starches, dextrins, oils and fats) and delves extensively into the manufacturing elements and technological themes in wafer manufacturing, including no/low sugar wafers, hygroscopic wafers, fillings and enrobing. The book explains, in detail, operating procedures such as mixing, baking, filling, cooling, cutting and packaging for every type of wafer: flat and shaped wafers for making biscuits, ice cream cones, cups, wafer reels, wafer sticks (flute wafers) and biscuit wafers. It also explores the various types of European (Belgian) waffles and North American frozen waffles.
Front Cover; The Technology of Wafers and Waffles I: Operational Aspects; Copyright; Dedications ; Contents; Preface; Foreword; Chapter One: Introduction; 1.1. Terminology and Definitions in Wafers and Waffles; 1.1.1. Wafers; 1.1.1.1. Two Meanings; 1.1.1.2. The Characteristics of Wafers; 1.1.1.3. The Two Basic Types of Wafers; 1.1.1.4. Maintaining Consistent Terminology; 1.1.2. Waffles; 1.1.2.1. Maintaining Consistent Terminology; 1.1.3. The Various Products and Terms in the Wafers and Waffles Segment; 1.1.3.1. Belgian Waffles
1.1.3.2. Communion Wafer (Host, Altar/Eucharistic/Sacramental Bread)1.1.3.3. Fan Wafers; 1.1.3.4. Flat Wafers; 1.1.3.5. Fortune Cookies; 1.1.3.6. Flute Wafers (Wafer Sticks, Wafer Rolls, Wafer Curls); 1.1.3.7. Hollow Wafers (Shaped Wafers); 1.1.3.8. Noncreamed Wafers; 1.1.3.9. Sandwich Wafer Bars; 1.1.3.10. Snack Size Flute Wafers; 1.1.3.11. Sugar Wafer Biscuits (Wafer Fingers); 1.1.3.12. Wafer Books; 1.1.3.13. Wafer Bread; 1.1.3.14. Wafer Bricelets; 1.1.3.15. Wafer Cookies-Wafer Biscuits; 1.1.3.16. Wafer Cones/Cups; 1.1.3.17. Wafer Paper (German: Oblaten)
1.1.3.18. Wafer Pattern and Waffle Pattern1.1.3.19. Wafer Reels; 1.1.3.20. Waffles, Frozen; 1.1.3.21. Waffles, Ready to Eat (RTE); 1.2. Wafers and Waffles-Some Historical Glimpses; 1.2.1. Wafer-The Origins; 1.2.1.1. The Word `Wāfel; 1.2.1.2. A Drawing in the `Velislai biblia picta, Dated Between 1325 and 1349; 1.2.1.3. Wafer in Webster's Revised Unabridged Dictionary, 1913 (Page 1621); 1.2.2. Oblate (Host); 1.2.3. Hollow Wafers; Wafer Cones and Cups; 1.2.4. The First Automatic Wafer Ovens; 1.2.5. Vienna 1898-The Birth of a Famous Industrial Sugar Wafer Cookie
1.2.6. Sugar Wafer Reels and Flute Wafers (Wafer Sticks)1.2.7. Waffles; 1.2.7.1. Frozen Waffles; Further Reading; Chapter Two: Technology of Main Ingredients-Water and Flours; 2.1. Water-Properties and Functions in Wafer and Waffles; 2.1.1. Introduction and Overview; 2.1.1.1. Water in Wafer and Waffle Manufacturing; 2.1.1.2. Moisture in Wafers and Waffles; 2.1.2. Water Parameters and the Chemistry of Water; 2.1.2.1. Analytical Water Parameters; 2.1.2.2. Important Terms in Water Chemistry; Alkalinity of Water; Conductivity or Specific Conductance of Water; Hardness of Water
Temporary and Permanent HardnessTDS-Evaporation Residue; 2.1.3. Functions of Water in Wafer and Waffle Processing; 2.1.4. The Hardness of Water: Units, Classes and Impact; 2.1.4.1. International Units for Water Hardness; 2.1.4.2. Hardness Classification; 2.1.4.3. The Impact of Water Hardness and Ionic Composition; 2.1.5. Water Hardness Effects on Wafers and Baking Moulds; 2.1.5.1. The Influence of Water Hardness on Wafer Texture; 2.1.5.2. The Influence of Water Hardness on the Forming of Hot Sugar Wafers; 2.1.5.3. The Influence of Water Hardness on Baking Mould Residues.
Includes bibliographical references and index.