http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Introduction ; Chapter 1 -- The Bohr Atom ; Objective of this chapter ; 1.1- Sinusoidal waves ; 1.2- The case of the missing lines ; 1.3- The spectra from gasses and metals ; 1.4- The elements ; 1.5- The hydrogen spectrum ; 1.6- Light is a particle ; 1.7- The atom's structure ; 1.8- The Bohr atom ; 1.9- Summary/Review ; Appendix 1.1 -- Some details of the Bohr model ; Appendix 1.2 -- Semiconductor materials ; Chapter 2 -- Energy Bands ; Objective of this chapter ; 2.1 -- Bringing atoms together ; 2.2 -- The insulator ; 2.3 -- The Conductor ; 2.4 -- The semiconductor ; 2.5 -- Digression -- A water analogy ; 2.6 -- The mobility of charges ; Summary and conclusions ; Appendix 2.1 -- Energy gap in Semiconductors ; Appendix 2.2 -- Number of electrons and the Fermi function ; Chapter 3 -- Types of Semiconductor ; Objectives of this chapter ; 3.1 -- Semiconductor Materials ; 3.2 -- Short summary of semiconductor materials ; 3.2.1 -- Silicon ; 3.2.2 -- Germanium ; 3.2.3 -- Gallium Arsenide ; 3.3 -- Intrinsic Semiconductors ; 3.4 -- Doped Semiconductors -- n-type ; 3.5 -- Doped Semiconductors -- p-type ; 3.6 -- Additional considerations ; Conclusion and summary ; Appendix 3.1 -- The Fermi levels in doped semiconductors ; Appendix 3.2 -- Why all donor electrons go to the conduction band ; Chapter 4 -- Infrared detectors ; Objectives of this chapter ; 4.1 -- What is infrared radiation ; 4.2 -- What our eyes can see ; 4.3 -- infrared Applications ; 4.4- Types of infrared radiation ; 4.5 -- Extrinsic silicon infrared detectors ; 4.6 -- Intrinsic infrared detectors. ; Summary and conclusions ; Appendix 4.1 -- Light Diffraction ; Appendix 4.2 -- Black Body Radiation ; Chapter 5 -- The pn-junction ; Objectives of this chapter ; 5.1 -- The pn-junction ; 5.2 -- The Semiconductor Diode ; 5.3 -- The Schottky Diode ; 5.4 -- The Zener or Tunnel Diode ; Conclusions and Summary ; Appendix 5.1 -- Fermi levels of a pn junction ; Appendix 5.2 -- Diffusion and drift currents ; Appendix 5.3 -- The thickness of the transition region ; Appendix 5.4 -- Work Function and the Shockley diode ; Chapter 6 -- Other Electrical Components ; Objective of this chapter ; 6.1 -- Voltage and Current ; 6.2 -- The Resistance ; 6.3 -- The Capacitor ; 6.4 -- The Inductor ; 6.5 -- Sinusoidal Voltages ; 6.6 -- Inductor application ; Conclusions and summary ; Appendix 6.1 -- Impedance and phase changes ; Chapter 7 -- Diode Applications ; 7.1 -- Solar Cells ; 7.2 -- Rectifiers ; 7.3 -- Current Protection ; 7.4 -- Clamping Circuit ; 7.5 -- Voltage Clipper ; 7.6 -- Half-Wave Voltage Doubler ; 7.7 -- Solar Cells Bypass diodes ; 7.8 -- Applications of Shockley Diodes ; 7.9 -- Application of Zener Diodes ; Conclusion and summary ; Appendix 7.1 -- Details on the voltage doubler ; Chapter 8 -- The Transistors ; OBCETIVE OF THIS CHAPTER ; 8.1 -- The concept of the transistor ; 8.2 -- The Bipolar Junction Transistor, BJT ; 8.3 -- The Junction Field Effect Transistor, JFET ; 8.4 -- The MOSFET ; Conclusions and summary ; Chapter 9 -- Transistor Biasing Circuits ; Objective of this chapter ; 9.1 -- Introduction ; 9.2 -- Emitter Feedback Bias ; 9.3 -- A simple transistor amplifier ; 9.4 -- A fixed bias circuit ; 9.5 -- The Collector bias circuit ; 9.6 -- Power considerations ; 9.7 -- Multi-stage transistor amplifiers ; 9.8 -- Operational amplifier, OpAmp ; 9.9 -- The ideal OpAmp ; Summary and Conclusions ; Appendix 9.1 -- Derivation of the stability of Collector feedback ; Chapter 10 -- Integrated circuit (IC) fabrication ; Objective of this chapter ; 10.1 -- The basic material ; 10.2 -- The Boule ; 10.2.1 -- The Czochralski method ; 10.2.2 -- The Flow-Zone method ; 10.3 -- The wafers and epitaxial growth ; 10.4 -- Photolithography ; 10.5 -- The fabrication of a pnp transistor on a silicon waver ; 10.6 -- A digression on doping ; 10.6.1 -- Thermal diffusion ; 10.6.2 -- Implantation ; 10.7 -- Resume our transistor processing ; 10.7.1 -- The contacts ; 10.7.2 -- Metallization ; 10.7.3 -- Multiple interconnects ; 10.8 -- Fabrication of other components ; 10.8.1 The integrated resistor ; 10.8.2 The integrated capacitor ; 10.8.3 Integrated inductor ; 10.9 -- Testing and Packaging ; 10.10 -- Clean rooms ; 10.11 -- Additional thoughts about processing ; Appendix 10.1 -- Miller indices in the diamond structure ; Chapter 11 -- Logic circuits ; Objectives of this chapter ; 11.1 -- Boolean algebra ; 11.2 -- The logic symbols ; 11.3 -- The electronic inside the symbols ; 11.3.1 -- Diode implementation ; 11.3.2 -- CMOS implementation ; 11.4- The inverter of NOT circuit ; 11.5 -- The NOR circuit ; 11.6 -- The NAND circuit ; 11.7 -- The XNOR or the exclusive NOR ; 11.8 -- The half adder ; 11.9 -- The full adder ; 11.10 -- Adding more than two digital numbers ; 11.11 -- The subtractor ; 11.12 -- Digression; flip-flops, latches and shifters ; 11.13 -- Multiplication and division of binary numbers ; 11.14 -- Additional comments, speed and power ; Conclusion and summary ; Appendix 11.1 -- Algebraic formulation of logic modules ; Appendix 11.2 -- Detailed analysis of the full adder ; Appendix 11.3 -- Complementary numbers ; Appendix 11.4 -- Dividing digital numbers ; Chapter 12 -- VLSI components ; Objectives of this chapter ; 12.1 -- Multiplexers, MUX ; 12.2 -- De-multiplexer, DEMUX ; 12.3 -- Registers ; 12.4 -- Timing and Waveforms ; 12.5 -- Memories ; 12.5.1 -- The Static Random-Access Memory, SRAM ; 12.5.2 -- The Dynamic Random-Access memory, DRAM ; 12.5.3 -- Read Only Memory, ROM ; 12.5.4 -- Programable Read only Memory, PROM ; 12.6 -- Gate arrays ; Conclusions and summary ; Appendix 12.1 -- A NAND implementation of a 2 to 1 MUX ; Chapter 13 -- Opto-Electronics ; Objective of this chapter ; 13.1 -- Photoconductors ; 13.2- PIN diodes ; 13.3 -- Lasers ; 13.3.1 -- The laser action ; 13.3.2 -- Solid State lasers ; 13.3.3 -- Semiconductor Lasers ; 13.3.4 -- Laser applications ; 13.4 -- Light Emitting Diodes, LEDs ; Summary and Conclusions ; Appendix 13.1 -- The detector readout ; Chapter 14 -- Microprocessors and computers ; 14.1 -- The computer ; 14.1.1 -- The computer architecture ; 14.1.2 -- The Memories ; 14.1.3 -- Input and output units ; 14.1.4 -- The central processing unit, CPU ; 14.2 -- Microcontrollers ; 14.3 -- Liquid Crystal Displays, LCDs ; 14.3.1 -- Liquid Crystal materials ; 14.3.2 -- The contacts ; 14.3.3 -- The color Filters ; 14.
Includes bibliographical references and index.