Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis /

The Book has 16 Chapters which discuss: signal integrity, power integrity, electromagnetic compatibility (EMC), TAN applications, PCB components analysis, Z/Y/T/S matrices, rectangular waveguide structures' modelling, PCB-lumped systems, distributed PCB modelling, EM fields, conducted emissions...

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Bibliographic Details
Corporate Author: Institution of Engineering and Technology
Other Authors: Ravelo, Blaise (Editor), Zhifei Xu (Editor)
Format: eBook
Language:English
Published: Stevenage : IET, 2020.
Series:Materials, Circuits & Devices.
Subjects:
Online Access:Connect to the full text of this electronic book
Description
Summary:The Book has 16 Chapters which discuss: signal integrity, power integrity, electromagnetic compatibility (EMC), TAN applications, PCB components analysis, Z/Y/T/S matrices, rectangular waveguide structures' modelling, PCB-lumped systems, distributed PCB modelling, EM fields, conducted emissions, PCB-conducted susceptibility, PCB-radiated susceptibility, shielded coaxial short cable, loop probe coupling, ADC-based mixed PCB, RF interference, electromagnetic interference, far field prediction, boundary elements method.
Physical Description:1 online resource (400 pages)
ISBN:9781839530500
DOI:10.1049/PBCS072E