Cover Image

Advances in RAMS engineering : in honor of Professor Ajit Kumar Verma on his 60th birthday /

Bibliographic Details
Corporate Author: ProQuest (Firm)
Other Authors: Karanki, Durga Rao, Vinod, Gopika, Ajit, Srividya
Format: eBook
Language:English
Published: Cham : Springer, 2020.
Series:Springer series in reliability engineering.
Subjects:
Reliability (Engineering)
Maintainability (Engineering)
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Intro
  • Dedication
  • Foreword
  • Preface
  • Reliability and Availability
  • Maintainability
  • Safety
  • Acknowledgements
  • Contents
  • Contributors
  • Reliability and Availability Engineering
  • 1 DC and AC Contingency Solvers in Composite Power System Adequacy Assessment
  • 1 Composite System Adequacy
  • 1.1 General Elements
  • 1.1.1 Input Data
  • 1.1.2 System State
  • 1.1.3 Isolated Buses
  • 1.1.4 Identification of Isolated Buses
  • 1.2 DC-Contingency Solver
  • 1.2.1 Network Model
  • 1.2.2 Contingency Solver Description
  • 1.2.3 Optimal Power Flow Formulation
  • 1.2.4 Contingency Solver Verification
  • 1.2.5 Illustrative Example
  • Step by Step Calculations
  • Composite System Adequacy Assessment
  • Calculation of the Reliability Indices
  • 1.3 AC-Contingency Solver
  • 1.3.1 Network Model
  • 1.3.2 Contingency Solver Description
  • 1.3.3 Optimal Power Flow Formulation
  • 1.3.4 Initial Starting Point
  • 1.3.5 Contingency Solver Verification
  • 1.3.6 Illustrative Example
  • Step by Step Calculations
  • Composite System Adequacy Assessment
  • 1.4 Reducing the Computation Time of HLII Assessment
  • 1.4.1 Parallel Computation
  • 2 Concluding Remarks
  • 1 Background
  • 2 Ageing and Condition Monitoring
  • 3 The Proposed Approach
  • 4 Reliability Prediction by Stress Strength Interference Theory
  • 4.1 Methodology
  • 4.2 Analysis and Results
  • 4.3 Summary
  • 5 Reliability Prediction from Experimentally Determined Performance Indicators
  • 5.1 Reliability Prediction from EAB
  • 5.2 Results with Lognormal Distribution of Parameter A
  • 5.3 Results with Gumbel (Min) Distribution of Parameter A
  • 6 Reliability Prediction from OIT
  • 7 Summary
  • References
  • 4 Fatigue Life Model for PLCC Solder Joints Under Thermal Cycling Stress
  • Abstract
  • 1 Introduction
  • 2 Background
  • 2.1 Solder Joints
  • 2.2 Fatigue Failure
  • 2.3 Fatigue Mechanism Due to Thermal Cycling
  • 2.3.1 Fatigue Model
  • 3 Description of Sample
  • 4 Estimation of Stress/Strain Relationship Using Finite Element Model (FEM)
  • 4.1 Non-Linear FEA
  • 5 Thermal Cycle Stress and Results
  • 5.1 FEA Results
  • 6 Experimentation
  • 6.1 Pre-Experiment Defect Record
  • 6.2 Planning of Test Profile
  • 6.3 Acceleration Factor (AF) Estimation
  • 6.4 Test Setup
  • 6.5 Results
  • 7 Estimation of Coffin-Manson Model Parameters
  • 8 Summary and Discussion
  • Acknowledgements