rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: RF and Microwave Module Level Design and Integration
  name:
    name part: Almalkawi, Mohammad.
    role:
      role term: creator
  name:
    name part: Institution of Engineering and Technology
  type of resource: text
  origin info:
    place:
      place term: enk
    date issued: 2019
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: electronic
    form: remote
    extent: 1 online resource (337 pages)
  abstract: This book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While design for manufacturability (DFM) and design for testability (DFT) are two important practices that stress the need for careful attention at the early design stages of a product, module integration to achieve optimal RF performance is an art form that takes years to master. In this context, the objective of this book is to provide the necessary practical and theoretical background needed to tackle a multitude of issues accompanied by the design of contemporary RF modules. The topics covered can serve a broad range of individuals: those just entering the field, graduate-level students, and researchers, as well as practicing engineers seeking new domains to expand their knowledge, understand design tradeoffs, and looking for a quick guide in digesting the several aspects of the RF module design processes and their common challenges. The book comprises eight chapters which discuss: packaging, lumped and distributed passive elements, microwave network analysis, impedance matching networks, electromagnetic field couplings, CAD, components of RF front-end modules, component- and module-level measurements.
  target audience: specialized
  note: Mohammad Almalkawi.
  subject:
    topic: Computer-aided design
  subject:
    topic: Electric circuits
  subject:
    topic: Electric networks, Passive
  subject:
    topic: Electronic circuit design
  subject:
    topic: Electronic packaging
  subject:
    topic: Impedance matching
  subject:
    topic: Lumped elements (Electronics)
  subject:
    topic: Microwave circuits
  subject:
    topic: circuit CAD
  subject:
    topic: electromagnetic coupling
  subject:
    topic: electronics packaging
  subject:
    topic: impedance matching
  subject:
    topic: lumped parameter networks
  subject:
    topic: microwave circuits
  subject:
    topic: modules
  subject:
    topic: passive networks
  subject:
    topic: CAD
  subject:
    topic: RF circuits
  subject:
    topic: RF device
  subject:
    topic: RF front-end modules
  subject:
    topic: component-level measurements
  subject:
    topic: device packaging
  subject:
    topic: distributed passive elements
  subject:
    topic: electromagnetic field couplings
  subject:
    topic: impedance matching networks
  subject:
    topic: lumped passive elements
  subject:
    topic: microwave circuits
  subject:
    topic: microwave device
  subject:
    topic: microwave network analysis
  subject:
    topic: module packaging
  subject:
    topic: module-level measurements
  related item:
    title info:
      title: Materials, Circuits & Devices
  identifier: 9781785613609
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: UkSgIET
    record creation date: 190724
    record change date: 20210304161740.0
    record identifier: in00004090153
    language of cataloging:
      language term: eng