Advanced thermal stress analysis of smart materials and structures /

Bibliographic Details
Main Author:	Chen, Zengtao
Corporate Author:	ProQuest (Firm)
Other Authors:	Akbarzadeh, Abdolhamid
Format:	eBook
Language:	English
Published:	Cham : Springer, 2020.
Series:	Structural integrity ; v. 10.
Subjects:	Smart materials. Smart structures. Thermal stresses. Materials > Thermal conductivity. Electronic books.
Online Access:	Connect to the full text of this electronic book

Description
Item Description:	Description based upon print version of record. 4.3.2 Hollow Cylinder Problem Electronic resource.
Physical Description:	1 online resource.
Bibliography:	Includes bibliographical references.
ISBN:	9783030252014 3030252019
ISSN:	2522-5618 ;