Mechanical characterization study of sintered silver pastes bonded in a double-lap configuration /

Bibliographic Details
Main Author: Paret, Paul (Author)
Corporate Author: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Format: Government Document Conference Proceeding eBook
Language:English
Published: [Golden, Colorado] : National Renewable Energy Laboratory, 2018.
Series:Conference paper (National Renewable Energy Laboratory (U.S.)) ; 5400-71381.
Subjects:
Online Access:https://purl.fdlp.gov/GPO/gpo118887
Description
Item Description:"October 2018."
"Presented at American Society of Mechanical Engineers (ASME) 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2018) San Francisco, California August 27-30, 2018."
Physical Description:1 online resource (7 pages) : color illustrations.
Bibliography:Includes bibliographical references (page 7).