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180228s2018 enk of 001 0 eng d |
| 020 |
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|a 9780128123126
|q (electronic bk.)
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| 020 |
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|a 0128123125
|q (electronic bk.)
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|z 9780128123119
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|a 40028042632
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|a (NhCcYBP)ybp15187991
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|a NhCcYBP
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|d UtOrBLW
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|a TK7872.T55
|b H36 2018
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| 072 |
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|a TEC
|x 009070
|2 bisacsh
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| 082 |
0 |
4 |
|a 621.3815/2
|2 23
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| 245 |
0 |
0 |
|a Handbook of thin film deposition /
|c edited by Krishna Seshan, Dominic Schepis.
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| 250 |
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|a Fourth edition.
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| 264 |
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1 |
|a Oxford, United Kingdom ;
|a Cambridge, MA, United States :
|b William Andrew, and imprint of Elsevier,
|c [2018]
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| 300 |
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|a 1 online resource.
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 500 |
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|a Includes index.
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| 588 |
0 |
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|a Vendor-supplied metadata.
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0 |
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|a Front Cover; Handbook of Thin Film Deposition; Copyright Page; Dedication; Contents; List of Contributors; Biographies; Preface; I. Scaling; 1 A Perspective on Todayâ#x80;#x99;s Scaling Challenges and Possible Future Directions; 1.1 Introduction; 1.2 Review and Update of Generalized Scaling; 1.3 Energy/Performance Considerations; 1.4 Design Issues with Back-Gated Thin SOI CMOS; 1.5 Carrier Confinement and Quantization Effects; 1.6 Potential of Low-Temperature Operation; 1.7 Conclusion; Acknowledgments; References; 2 Limits and Hurdles to Continued CMOS Scaling; 2.1 Terminology; 2.2 Costs
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| 505 |
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|a 2.3 ITRS Roadmap-based Issues2.4 Issues in Device Scaling; 2.5 Scaling Basics and Results; 2.5.1 Contact Spacing and SRAM Size; 2.6 Lithography; 2.6.1 Resolution; 2.7 Litho Wavelength Evolution; 2.7.1 CMOS Scaling and Various Leakages; 2.7.2 Ioff Leakage, Tunneling Current, Source-Drain Leakage; 2.7.3 Increase of ON-current; 2.7.4 Leakage Currents and the Limits Imposed by Them; 2.7.5 Gate Overlap Capacitance; 2.7.6 Subthreshold Leakage; 2.7.7 Hot-e Leakage; 2.8 Limits created by a falling Vt and Vcc; 2.9 Scaling Limits and Device Limitationsâ#x80;#x94;Roadmap Based; 2.9.1 Scaling of Memory: GIDL
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| 505 |
8 |
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|a 2.9.2 New Device Features and New Materials2.9.3 Use of Si-Ge and strained layers to enhance mobility: is this scalable?; 2.9.4 New Materials: Graphene; 2.10 Back-End Scaling Issues; 2.10.1 Back-End Scaling: Contact Pitch; 2.10.2 SRAM Cell Size; 2.10.3 Metal Layers: Metal/Dielectric Scaling/the Need for New Materials; 2.10.4 Thermal Conductivity Limits: Cooling Issues; 2.10.5 Low-temperature Liquid Nitrogen Cooled Computers; 2.10.6 Thermodynamic Considerations: Noise; 2.11 Fluctation in Dopant Distribution: Effect on Vt Thermodynamic issues
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| 505 |
8 |
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|a 2.11.1 Thermal Fluctuations, Thermodynamics of Computations: the Work of Bennett, Keyes, and Feynman2.11.2 Heat Production and Chip Cooling; 2.12 Considerations in Heat Production; 2.13 Conclusions; References; Classic Papers; Cost of Fabricators; ITRS Roadmap Publications; Lithography; Device Scaling Limits; Metal Gates; FINFETS; NanoWires; Leakage Currents in Transistors; Gate Leakage; Leakages as a Limiter in Scaling; References to Graphene; Heat Production; Also see chapter 4 on Thermal Limits; This Handbook; Limits of Computing; Low-temperature Electronics; Further Reading
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| 505 |
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|a 3 Reliability Issues: Reliability Imposed Limits to Scaling3.1 Introduction and History; 3.1.1 History of Reliability; 3.1.2 New and Traditional Views of Reliability; 3.1.3 Concerns of Reliability; 3.1.4 Display of Reliability Data; 3.2 Reliability Testing Procedures; 3.3 Front-End Reliability Issues Impacting Scaling and Various Leakages; 3.4 Back-end Reliability; 3.4.1 Thermally Activated Failures; Arrhenius Equation and Electromigration; 3.4.2 Electromigration and Blackâ#x80;#x99;s equation; 3.4.3 Physically based models of electromigration: From Blackâ#x80;#x99;s equation to modern TCAD models
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| 500 |
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|a Electronic resource.
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| 650 |
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0 |
|a Thin films
|v Handbooks, manuals, etc.
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| 650 |
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0 |
|a Thin film devices
|x Design and construction.
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| 655 |
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7 |
|a Electronic books.
|2 local
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| 700 |
1 |
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|a Seshan, Krishna,
|e editor.
|0 http://id.loc.gov/authorities/names/n99253766
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| 700 |
1 |
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|a Schepis, Dominic,
|e editor.
|0 http://id.loc.gov/authorities/names/no2018055643
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| 710 |
2 |
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|a ScienceDirect (Online service)
|0 http://id.loc.gov/authorities/names/no00037061
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| 856 |
4 |
0 |
|u http://proxy.library.tamu.edu/login?url=http://www.sciencedirect.com/science/book/9780128123119
|z Connect to the full text of this electronic book
|t 0
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| 945 |
|
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|a machinegen
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| 955 |
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|a YBP purchased approval e-records
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| 980 |
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|b 299.00
|g 1
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| 952 |
f |
f |
|a Texas A&M University
|b College Station
|c Electronic Resources
|d Available Online
|t 0
|e TK7872.T55 H36 2018
|h Library of Congress classification
|
| 998 |
f |
f |
|a TK7872.T55 H36 2018
|t 0
|l Available Online
|