rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Advances in chemical mechanical planarization (CMP)
  name:
    name part: Babu, S. V.
    role:
      role term: editor.
  name:
    name part: Knovel (Firm)
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  origin info:
    place:
      place term: mau
    date issued: 2016
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource.
  abstract: Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.
  note: edited by Suryadevara Babu.
  note: Includes bibliographical references and index.
  subject:
    topic: Chemical mechanical planarization
  subject:
    topic: Nanoelectronics
  subject:
    topic: Microelectronics
  subject:
    topic: TECHNOLOGY & ENGINEERING / Mechanical
  subject:
    topic: Chemical mechanical planarization
  subject:
    topic: Microelectronics
  subject:
    topic: Nanoelectronics
  classification: TK7874.84
  classification: 621.381
  related item:
    title info:
      title: Woodhead Publishing series in electronic and optical materials ; number 86
  identifier: 9780081002186
  identifier: 0081002181
  identifier: 9780081001653
  identifier: 0081001657
  identifier: 887353 MIL
  identifier: http://proxy.library.tamu.edu/login
  record info:
    record content source: N$T
    record creation date: 160113
    record change date: 20260609152424.2
    record identifier: in00003835940
    language of cataloging:
      language term: eng