Robust design of microelectronics assemblies against mechanical shock, temperature and moisture /
This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...
| Main Authors: | , |
|---|---|
| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
Cambridge, UK :
Woodhead Publishing,
[2015]
|
| Series: | Woodhead Publishing series in electronic and optical materials ;
no. 81. |
| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |