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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture /

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This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...

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Bibliographic Details
Main Authors: Wong, E-H (Author), Mai, Y. W., 1946- (Author)
Corporate Author: Knovel (Firm)
Format: eBook
Language:English
Published: Cambridge, UK : Woodhead Publishing, [2015]
Series:Woodhead Publishing series in electronic and optical materials ; no. 81.
Subjects:
Computer engineering.
Microelectronics > Design.
TECHNOLOGY & ENGINEERING / Mechanical.
TECHNOLOGY & ENGINEERING / Electronics / Microelectronics.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Summary:This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. Detailed chapters cover: temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. --
Physical Description:1 online resource.
Bibliography:Includes bibliographical references and index.
ISBN:9780857099112
0857099116
1845695283
9781845695286
ISSN:2050-1501 ;